Singulated Die Sort (SDx) Engineering Manager - Kulim, Malaysia
Originally posted 29 October 2026 by the employer.
About the role
As a Singulated Die Sort (SDx) Engineering Manager within the Wafer Packaging Manufacturing group, you will lead a team of module and manufacturing operations engineers to transfer new products into high-volume factory production. You will direct process engineering, yield improvement, and tool installations to meet safety, quality, cost, and output goals.
What you'll do
- Lead and coach module engineers and manufacturing operations engineers to build technical expertise and leadership capabilities.
- Oversee technology transfer for new products, ensuring robust training and audit processes for matched processing across sites.
- Plan and direct process engineering, yield improvement, and manufacturing efficiency enhancements.
- Develop and implement modifications to operating equipment to optimize production efficiency and meet safety, quality, and cost goals.
- Manage resources and processes for successful install and qualification of tools during factory ramps.
- Collaborate with cross-functional teams to ensure new product readiness and feasibility for high-volume manufacturing.
What you'll need
- Bachelor's degree in a relevant engineering field with 9+ years of process engineering and management experience, a Master's degree with 6+ years of experience, or a PhD with 4+ years of experience.
- Expertise in manufacturing operations, yield improvement, and process optimization.
- Proficiency in leading technology transfer across sites and managing high-volume manufacturing ramps.
- Technical expertise in equipment modification for enhanced production efficiency and process development.
Nice to have
- Demonstrated success in people leadership, team coaching, and performance management.
- Experience working in a virtual factory environment and aligning cross-functional goals.
Skills: die sort, wafer packaging, technology transfer, yield improvement, module engineering
More semiconductor jobs: Packaging engineer jobs · Malaysia jobs
This role has been open 0 days — well below the 48-day median for Packaging Engineering roles.
Packaging Engineering · Packaging
|
Open roles in category
242
|
Median days open
48 d
|
Median salary
$166k
|
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
| Metric | Intel Corporation | All employers we track in this specialty (242 roles · 44 employers) |
|---|---|---|
| Open roles in this specialty | 12 | 242 |
| Open roles in the wider Process, Fab & Equipment family | 199 | 10323 · 107 employers |
| Median days open | 70 d | 48 d (+22 d vs this employer) |
| Median salary (USD postings) | — | $166k |
Skills observed across this category: die sort, wafer packaging, technology transfer, yield improvement, module engineering
Who's hiring in this category
- Renesas Electronics · 30 open roles · median 41 d
- Infineon Technologies · 26 open roles · median 41 d
- Micron Technology · 20 open roles · median 78 d
- onsemi · 16 open roles · median 34 d
- Skyworks · 15 open roles · median 2 d
- Intel Corporation (this employer) · 11 open roles · median 113 d
How we counted: 242 open Packaging Engineering (Packaging) roles from 44 employers tracked in the SemiconductorJobs index, counted 29 Oct 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.