Defect Metrology Process Devleopment Engineer - Kissimmee, FL 34744, USA
Originally posted 28 October 2026 by the employer.
Develop and improve AOI and metrology processes for advanced packaging platforms including Hybrid Bonding, Direct Bond Interconnect (DBI), and Fan-Out Wafer Level Packaging (FOWLP).
About the role
The Defect Metrology Process Development Engineer develops and improves automated optical inspection (AOI) and metrology processes for integrated advanced packaging process flows. The role focuses on heterogeneous integration technologies including Hybrid Bonding, Direct Bond Interconnect (DBI), 2.5D and 3D interposers, and Fan-Out Wafer Level Packaging (FOWLP).
What you'll do
- Implement and maintain metrology support systems, including add-on software packages and data collection archiving.
- Support fab operations with thickness and defect measurements, inspection of pillar heights and locations, AFM, and profilometry.
- Perform daily reviews of defect and SPC data to address excursions, disposition material, and drive yield improvements in layout and processing.
- Coordinate with engineering teams to report die pad locations through automation in fan-out wafer-level packaging applications.
- Partner with process and tool engineers to identify processing marginalities and drive integration changes for device performance and yield.
What you'll need
- Associate degree with 5+ years of semiconductor process technician experience, or a BS, MS, or PhD in Electrical Engineering, Electronics Engineering, or a related engineering discipline.
- Prior experience in defect inspection and semiconductor fab processing tools to provide defect feedback to process owners.
- Knowledge of MEMS, CMOS, or packaging inspection and metrology.
- Practical understanding of DOE, SPC, and 6-sigma concepts and applications.
- Status as a U.S. Person as defined by ITAR regulations (U.S. citizen, U.S. Permanent Resident, Political Asylee, or Refugee).
Nice to have
- Project management skills or defined project management training.
More semiconductor jobs: SkyWater Technology jobs · Packaging engineer jobs
This role has been open 0 days — well below the 63-day median for Packaging Engineering roles.
Packaging Engineering · Advanced Packaging
|
Open roles in category
298
|
Median days open
63 d
|
Median salary
$167k
|
See the full market breakdown ▾Category comparison, and who else is hiring
| Metric | SkyWater Technology | All employers we track in this specialty (298 roles · 59 employers) |
|---|---|---|
| Open roles in this specialty | 4 | 298 |
| Open roles in the wider Process, Fab & Equipment family | 86 | 10323 · 107 employers |
| Median days open | 46 d | 63 d (−17 d vs this employer) |
| Median salary (USD postings) | — | $167k |
Who's hiring in this category
- KLA Corporation · 42 open roles · median 140 d
- Micron Technology · 41 open roles · median 44 d
- Intel Corporation · 20 open roles · median 53 d
- Renesas Electronics · 17 open roles · median 45 d
- GlobalFoundries · 14 open roles · median 72 d
- Lumilens · 13 open roles · median 83 d
How we counted: 298 open Packaging Engineering (Advanced Packaging) roles from 59 employers tracked in the SemiconductorJobs index, counted 29 Oct 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.