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Neurophos

Senior/Staff Nanofabrication and Characterization Engineer

Neurophos Austin, Texas, United States Full-time 5 hours ago
Packaging & Advanced Integration

Originally posted 4 November 2026 by the employer.

About the role

As a Senior/Staff Nanofabrication and Characterization Engineer at Neurophos, you will build and characterize prototype metasurface chips for an optical vector-matrix multiplication (OVMM) engine. You will turn electromagnetic designs into masks and process flows, fabricate multilevel metal–dielectric nanostructures, integrate active tunable layers, and execute both physical metrology and electro-optic characterization.

What you'll do

  • Turn metasurface designs into multi-step process flows, travelers, and mask layouts using tools such as KLayout or L-Edit.
  • Pattern sub-200 nm features and execute multilayer alignment using electron-beam lithography, deep-UV steppers, and optical lithography.
  • Deposit and dry-etch metals, dielectrics, and thin conformal liners using sputtering, evaporation, PECVD, ALD, and RIE/ICP while controlling profiles to nanometer tolerances.
  • Build stacked metal–dielectric structures with vias and planarization (CMP, damascene, or lift-off), addressing misalignment, dishing, voids, and adhesion.
  • Integrate electro-optically tunable layers, complete device assembly (dicing, mounting, and wire-bonding), and maintain university cleanroom access and run cadence.
  • Perform process metrology (SEM, FIB cross-sections, AFM, profilometry, ellipsometry) and characterize optical response (reflectance, spectra, polarization, voltage tuning).

What you'll need

  • MS or PhD in Electrical Engineering, Materials Science, Applied Physics, Optics, or a closely related field centered on nanofabrication.
  • 3+ years of hands-on cleanroom experience fabricating nanophotonic, metasurface, plasmonic, MEMS, or semiconductor devices, with ownership of multi-step process flows.
  • Direct experience with electron-beam lithography and multilayer alignment at sub-200 nm feature sizes, including resist processing, dose, and proximity correction.
  • Hands-on expertise in metal and dielectric deposition and dry etch, including recipe development for profile, selectivity, and uniformity.
  • Proficiency with physical metrology tools including SEM, AFM, ellipsometry, and profilometry, as well as microscope-based optical characterization setups.
  • Scripting proficiency in Python or MATLAB for process data analysis and automated measurement, alongside layout tools such as KLayout or L-Edit.

Nice to have

  • Experience in university or shared-user nanofabrication facilities, including tool qualification and schedule management.
  • Background in damascene metallization, CMP, or other planarization processes for multilevel interconnect-like stacks.
  • Experience with atomic layer deposition (ALD) of conformal liners, post-CMOS processing, or heterogeneous integration on foundry wafers.
  • Experience working with tunable optical materials (liquid crystals, electro-optic polymers, phase-change materials) and cell assembly.
  • Hands-on packaging experience including dicing, die attach, wire bonding, and electrical probing.
  • Metasurface or nanophotonic design experience using full-wave electromagnetic simulation (FDTD, FEM, RCWA).

More semiconductor jobs: Packaging engineer jobs · Austin jobs

Market context

This role has been open 0 days — well below the 61-day median for Packaging Engineering roles.

Packaging Engineering · Advanced Packaging

Open roles in category
307
Median days open
61 d
Category median salary (all employers)
$167k
See the full market breakdown ▾Category comparison, and who else is hiring
How Neurophos compares in Packaging Engineering hiring
Metric Neurophos All employers we track in this specialty (307 roles · 63 employers)
Open roles in this specialty 1 307
Open roles in the wider Process, Fab & Equipment family 2 10126 · 116 employers
Median days open 0 d 61 d (−61 d vs this employer)
Median salary (USD postings) — $167k

Who's hiring in this category

  • Micron Technology · 41 open roles · median 50 d
  • KLA Corporation · 40 open roles · median 146 d
  • Intel Corporation · 20 open roles · median 48 d
  • Renesas Electronics · 18 open roles · median 42 d
  • Lumilens · 13 open roles · median 89 d
  • onsemi · 12 open roles · median 49 d

How we counted: 307 open Packaging Engineering (Advanced Packaging) roles from 63 employers tracked in the SemiconductorJobs index, counted 4 Nov 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.

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Austin, Texas, United States
On-site
Full-time
5 hours ago

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