Senior Staff Engineer Encapsulation
Optimize. Innovate. Deliver. Join us in redefining manufacturing excellence.
Originally posted 6 October 2026 by the employer.
About the role
As a Senior Staff Engineer Encapsulation in our Manufacturing and Operations team, you will be a process owner and expert driving innovation, pre-development, and development of the Molding process.
What you'll do
- Ensure timely development of robust Molding process in accordance to project timeline, yield, and cost targets.
- Develop unit process with compliance to requirements defined in the Process Development Handbook.
- Advocate Design for Manufacturing and Design for Cost.
- Lead definition and guide process, equipment, and material strategies as per alignment with the roadmap.
- Support End-to-End activities of projects to ensure smooth ramp up.
What you'll need
- Master/bachelor’s degree in engineering and physical science.
- Minimum 5 years of working experience in Mold Process Development.
- Good knowledge and application of Statistical tools (JMP, CEDA, etc).
- Analytical and problem-solving skills (P/DFMEA, DMAIC, 8D Methodology).
- Proficient in planning and executing Design of Experiment (DoE).
- Good knowledge in analytical (SAT) and metrological tools (Smart Scope, Hisomet, etc).
- Hands-on knowledge/skills in molding process assembly.
Skills: Molding process, IC Packaging, Process Development, Design of Experiment, Statistical tools
More semiconductor jobs: Infineon Technologies jobs · Packaging engineer jobs
This role has been open 28 days — well below the 40-day median for Packaging Engineering roles.
Packaging Engineering · Packaging
|
Open roles in category
259
|
Median days open
40 d
|
Category median salary (all employers)
$176k
|
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
| Metric | Infineon Technologies | All employers we track in this specialty (259 roles · 45 employers) |
|---|---|---|
| Open roles in this specialty | 28 | 259 |
| Open roles in the wider Process, Fab & Equipment family | 301 | 10056 · 105 employers |
| Median days open | 42 d | 40 d (+2 d vs this employer) |
| Median salary (USD postings) | — | $176k |
Skills observed across this category: Molding process, IC Packaging, Process Development, Design of Experiment, Statistical tools
Who's hiring in this category
- Renesas Electronics · 33 open roles · median 40 d
- Infineon Technologies (this employer) · 27 open roles · median 42 d
- Micron Technology · 19 open roles · median 49 d
- onsemi · 15 open roles · median 39 d
- Skyworks · 14 open roles · median 9 d
- STMicroelectronics · 14 open roles · median 17 d
How we counted: 259 open Packaging Engineering (Packaging) roles from 45 employers tracked in the SemiconductorJobs index, counted 3 Nov 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.