Intern, WB Process Engineering
Support research and development and customer application assistance for Wedge Bonder equipment.
About the role
This role supports research and development for new product development of Wedge Bonder equipment and customer application assistance in Santa Ana, California. You will work on projects focused on product viability, systems and process feasibility, and customer field issues.
What you'll do
- Assist senior engineers and technicians in documenting, testing, and data collection for assigned and on-going projects.
- Conduct destructive and non-destructive tests.
- Design and conduct experiments based on internal and customer requirements.
- Use analytical methods, metrology tools including SEM, Alicona, and Image Microscope, and data analysis tools such as Python and Excel to troubleshoot problems.
- Identify and contact external vendors for quotes and ordering based on project needs.
- Present reports with detailed documentation and concise summaries to senior engineers and managers.
What you'll need
- Status as a senior undergraduate student or Master's student.
- Ability to work independently and collaborate with staff engineers and technicians on projects.
- Organization, multitasking, communication, and interpersonal skills.
Nice to have
- Master's degree student status.
- Hands-on experience with electro-mechanical equipment.
- Coursework in engineering statistics, data analysis, SEM, CAD, and material science.
- Basic knowledge of the semiconductor industry and wedge wire bonding.
Skills: wedge wire bonding, process engineering, SEM, destructive testing, DOE
More semiconductor jobs: Packaging engineer jobs · California jobs
First seen in our index 0 days ago, well below the 31-day median for Packaging Engineering roles.
Packaging Engineering · Packaging
|
Open roles in category
288
|
Median days since first seen
31 d
|
Category median salary (all employers)
$187k
|
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
| Metric | Kulicke & Soffa | All employers we track in this specialty (288 roles · 46 employers) |
|---|---|---|
| Open roles in this specialty | 1 | 288 |
| Open roles in the wider Process, Fab & Equipment family | 28 | 10362 · 117 employers |
| Median days since first seen | 0 d | 31 d (+31 d vs this employer) |
| Median salary (USD postings) | n/a | $187k |
Skills observed across this category: wedge wire bonding, process engineering, SEM, destructive testing, DOE
Who's hiring in this category
- Infineon Technologies · 37 open roles · median 24 d
- Renesas Electronics · 33 open roles · median 27 d
- Micron Technology · 18 open roles · median 54 d
- onsemi · 17 open roles · median 44 d
- STMicroelectronics · 16 open roles · median 21 d
- SanDisk · 15 open roles · median 13 d
How we counted: 288 open Packaging Engineering (Packaging) roles from 46 employers tracked in the SemiconductorJobs index, counted 12 Nov 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there, and is counted in the wider Process, Fab & Equipment family row. Days are counted from when our index first saw each posting, not from the employer's original posting date.