Semiconductor Research Engineer
$141,910 - $200,340 USD yearly
Develop metrology solutions, EMIB, and Foveros architectures in the Assembly Materials Characterization Lab.
About the role
As a Semiconductor Research Engineer at Intel Corporation, you will design, develop, and test devices, interconnects, and packaging solutions leveraging device physics, electromagnetics, and materials science. This position sits within the Assembly Materials Characterization Lab, focusing on metrology solutions for advanced packaging architectures.
What you'll do
- Conduct research using device physics, optics, electromagnetics, and thermomechanical analysis to enable novel devices and packaging technologies.
- Design and fabricate metrology prototypes to validate concepts for semiconductor assembly and interconnect solutions.
- Develop testing methodologies for component and device characterization, including dimension, optical signal loss, and stressing.
- Plan and execute experiments with cross-functional teams to benchmark results against industry standards.
- Model and analyze trade-offs between design, performance, and reliability to ensure optimal packaging and assembly solutions.
- Collaborate with external vendors and researchers to support Intel's research pipeline.
What you'll need
- Master's in Electrical Engineering, Physics, Materials Science, Mechanical Engineering, or a related field with 4+ years of experience, or a PhD with 2+ years of experience.
- Research experience in optical test metrology, dimensional metrology, and packaging design methodologies.
- Programming skills in Python or MATLAB for engineering applications.
- Experience building experimental setups and applying data analysis techniques for lab testing.
Nice to have
- Experience with advanced Co-Packaged Optics (CPO).
- Experience with advanced packaging technologies including EMIB and Foveros architectures.
- Expertise in Design of Experiments (DOE), statistical analysis methods, and model-based problem-solving techniques.
- Familiarity with materials characterization techniques.
Skills: advanced packaging, EMIB, Foveros, metrology, materials characterization, CPO
More semiconductor jobs: Intel Corporation jobs · Packaging engineer jobs · Arizona jobs
This role has been open 0 days — well below the 57-day median for Packaging Engineering roles.
Packaging Engineering · Advanced Packaging
|
Open roles in category
307
|
Median days open
57 d
|
Category median salary (all employers)
$167k
|
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
| Metric | Intel Corporation | All employers we track in this specialty (307 roles · 64 employers) |
|---|---|---|
| Open roles in this specialty | 20 | 307 |
| Open roles in the wider Process, Fab & Equipment family | 221 | 10083 · 117 employers |
| Median days open | 40 d | 57 d (−17 d vs this employer) |
| Median salary (USD postings) | — | $167k |
Skills observed across this category: advanced packaging, EMIB, Foveros, metrology, materials characterization, CPO
Who's hiring in this category
- Micron Technology · 41 open roles · median 51 d
- KLA Corporation · 39 open roles · median 147 d
- Intel Corporation (this employer) · 19 open roles · median 42 d
- Renesas Electronics · 17 open roles · median 52 d
- Lumilens · 13 open roles · median 90 d
- onsemi · 12 open roles · median 50 d
How we counted: 307 open Packaging Engineering (Advanced Packaging) roles from 64 employers tracked in the SemiconductorJobs index, counted 5 Nov 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.