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PsiQuantum

Manufacturing Engineer

PsiQuantum Milpitas, California, United States Full-time 1 day ago
Packaging & Advanced Integration

$123,700 USD yearly

Develop, qualify, and control specialty epoxy and thermal paste dispensing and cure processes using Nordson dispense systems.

Originally posted 13 November 2026 by the employer.

About the role

PsiQuantum is seeking a Manufacturing Process Engineer to develop, qualify, and launch processes for new products and technologies. This role works across engineering, operations, quality, and manufacturing partners to transition processes from development into reliable production.

What you'll do

  • Lead process development, qualification, and manufacturing readiness for new products and processes.
  • Partner with design, process, quality, equipment, and operations teams to define process requirements and production controls.
  • Develop and maintain process documentation, including work instructions, process specifications, and control plans.
  • Establish and apply statistical process control (SPC) methods to monitor process performance, identify variation, and resolve manufacturing issues through root cause analysis.
  • Develop, qualify, and control specialty epoxy and thermal paste dispensing and cure processes, as well as benchtop tooling, fixtures, ovens, and Nordson dispense systems.
  • Own MES manufacturing process-flow development and integrate build data to support traceability and process control.

What you'll need

  • Bachelor’s degree in engineering.
  • Experience launching new processes and products into manufacturing.
  • Hands-on experience with specialty epoxy or thermal paste dispense and cure.
  • Experience qualifying benchtop tooling and fixtures.
  • Hands-on experience with MES process-flow development with build-data integration.
  • Demonstrated root-cause analysis and process improvement experience.

Nice to have

  • Experience in photonics or semiconductor manufacturing.
  • Experience with semiconductor packaging processes, including die attach and wire bonding.
  • SPC implementation and use in a production environment.
  • Experience in automation equipment development or integration, or manufacturing tooling development.
  • Background in process qualification and production transfer within high-technology manufacturing environments.

More semiconductor jobs: PsiQuantum jobs · Packaging engineer jobs · California jobs

Market context

First seen in our index 0 days ago, well below the 60-day median for Packaging Engineering roles.

Packaging Engineering · Advanced Packaging

Open roles in category
328
Median days since first seen
60 d
Category median salary (all employers)
$167k
See the full market breakdown ▾Category comparison, and who else is hiring
How PsiQuantum compares in Packaging Engineering hiring
Metric PsiQuantum All employers we track in this specialty (328 roles · 65 employers)
Open roles in this specialty 3 328
Open roles in the wider Process, Fab & Equipment family 16 10410 · 119 employers
Median days since first seen 155 d 60 d (−95 d vs this employer)
Median salary (USD postings) n/a $167k

Who's hiring in this category

  • Micron Technology · 45 open roles · median 57 d
  • KLA Corporation · 39 open roles · median 153 d
  • Intel Corporation · 24 open roles · median 35 d
  • Renesas Electronics · 23 open roles · median 37 d
  • Lumilens · 13 open roles · median 98 d
  • AMD · 12 open roles · median 43 d

How we counted: 328 open Packaging Engineering (Advanced Packaging) roles from 65 employers tracked in the SemiconductorJobs index, counted 13 Nov 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there, and is counted in the wider Process, Fab & Equipment family row. Days are counted from when our index first saw each posting, not from the employer's original posting date.

Apply now
Milpitas, California, United States
On-site
Full-time
$123,700 USD yearly
1 day ago

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