$60,320 - $101,920 USD yearly
About the role
This internship role focuses on hands-on development and failure analysis within the High Performance Analog business group.
What you'll do
- Assist in the hands-on development of semiconductor and heterogeneous microelectronics assembly processes.
- Perform failure analysis and generate experimental data.
- Conduct data generation and analysis across assembly projects.
- Document and present experimental findings and project results to the team and business leaders.
What you'll need
- Current enrollment in an accredited program seeking a PhD in Electrical, Mechanical, Physics, Chemistry, or Material Sciences Engineering.
- Hands-on process development skills.
- Familiarity or expertise with semiconductor device and wafer-level processes, or electrical/thermal/mechanical design and modeling, or advanced materials.
Nice to have
- Experience with FIB, SEM, SAM, IR, or XRAY analysis.
- Experience with statistical data analysis tools such as Spotfire, Minitab, or Excel.
Skills: microelectronics assembly, failure analysis, FIB, SEM, heterogeneous integration
More semiconductor jobs: Packaging engineer jobs
This role has been open 9 days — well below the 59-day median for Packaging Engineering roles.
Packaging Engineering · Advanced Packaging
|
Open roles in category
321
|
Median days open
59 d
|
Category median salary (all employers)
$167k
|
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
| Metric | Skyworks | All employers we track in this specialty (321 roles · 65 employers) |
|---|---|---|
| Open roles in this specialty | 8 | 321 |
| Open roles in the wider Process, Fab & Equipment family | 153 | 10057 · 117 employers |
| Median days open | 59 d | 59 d (same as this employer) |
| Median salary (USD postings) | — | $167k |
Skills observed across this category: microelectronics assembly, failure analysis, FIB, SEM, heterogeneous integration
Who's hiring in this category
- Micron Technology · 42 open roles · median 54 d
- KLA Corporation · 40 open roles · median 150 d
- Intel Corporation · 23 open roles · median 30 d
- Renesas Electronics · 22 open roles · median 25 d
- Lumilens · 13 open roles · median 93 d
- Infineon Technologies · 11 open roles · median 49 d
How we counted: 321 open Packaging Engineering (Advanced Packaging) roles from 65 employers tracked in the SemiconductorJobs index, counted 8 Nov 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.