$20 - $30 USD hourly
Originally posted November 13, 2026 by the employer.
About the role
This 12-14 week internship supports the Thermal Interface Materials (TIMs) development program in San Luis Obispo, CA. The focus is on enabling thermal management solutions for semiconductor applications.
What you'll do
- Support the Thermal Interface Materials (TIMs) development program.
- Conduct material screening experiments in a laboratory environment.
- Perform material characterization on experimental samples.
- Execute thermal management testing following strict laboratory safety procedures.
What you'll need
- Current enrollment in a Bachelors, Masters, or PhD degree program in Materials Science and Engineering, Polymer Science and Engineering, Chemical Engineering, or Mechanical Engineering with a focus on thermal management or materials.
- 1 to 2 years of experience in polymers, composites, material properties, or thermal management and heat transfer applications.
- Availability to work 40 hours per week, Monday through Friday, from May through August.
- Ability to perform hands-on experimental activities and safely handle chemicals, powders, and laboratory equipment.
Nice to have
- Bachelor students enrolled in 3rd or 4th year, or Master students in 2nd or 3rd semester.
Skills: thermal interface materials, TIM, thermal management, material characterization, polymers
More semiconductor jobs: Entegris jobs · Packaging engineer jobs · California jobs
First seen in our index 1 day ago, well below the 30-day median for Packaging Engineering roles.
Packaging Engineering · Packaging
|
Open roles in category
300
|
Median days since first seen
30 d
|
Category median salary (all employers)
$187k
|
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
| Metric | Entegris | All employers we track in this specialty (300 roles · 49 employers) |
|---|---|---|
| Open roles in this specialty | 2 | 300 |
| Open roles in the wider Process, Fab & Equipment family | 386 | 10378 · 119 employers |
| Median days since first seen | 121 d | 30 d (−91 d vs this employer) |
| Median salary (USD postings) | n/a | $187k |
Skills observed across this category: thermal interface materials, TIM, thermal management, material characterization, polymers
Who's hiring in this category
- Infineon Technologies · 37 open roles · median 26 d
- Renesas Electronics · 34 open roles · median 29 d
- Micron Technology · 18 open roles · median 56 d
- onsemi · 18 open roles · median 45 d
- STMicroelectronics · 17 open roles · median 22 d
- SanDisk · 14 open roles · median 15 d
How we counted: 300 open Packaging Engineering (Packaging) roles from 49 employers tracked in the SemiconductorJobs index, counted 14 Nov 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there, and is counted in the wider Process, Fab & Equipment family row. Days are counted from when our index first saw each posting, not from the employer's original posting date.