$26 - $47 USD hourly
About the role
This co-op role involves learning manual assembly and rework of multi-chip modules for testing, operating automated test benches, and performing basic manual RF tests. The co-op will review test results with Engineers and modify prototypes until performance meets specifications.
What you'll do
- Learn manual assembly and rework of multi-chip modules for testing
- Operate automated test benches
- Perform basic manual RF tests
- Review test results with Engineers
- Make modifications of prototypes
- Retest prototypes until performance meets specifications
What you'll need
- Current student pursuing an Associates or Bachelor's degree in Mechanical or Electrical Engineering or related discipline
- Knowledge and hands on experience with RF test equipment: multi-meter, Spectrum Analyzer, VNA, Oscilloscope, signal generators, power meter, power supplies
- Ability to understand schematics and diagrams
Nice to have
- IC Package assembly, component soldering, and reworks skills
- Familiarity with AutoCAD
- Knowledge of Microsoft tools
Skills: manual assembly, rework of multi-chip modules, automated test benches, RF tests, IC Package assembly, component soldering
More semiconductor jobs: Packaging engineer jobs · San Jose jobs
This role has been open 82 days — well above the 33-day median for Packaging Engineering roles.
Packaging Engineering · Packaging
|
Open roles in category
279
|
Median days open
33 d
|
Category median salary (all employers)
$186k
|
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
| Metric | Skyworks | All employers we track in this specialty (279 roles · 46 employers) |
|---|---|---|
| Open roles in this specialty | 11 | 279 |
| Open roles in the wider Process, Fab & Equipment family | 153 | 10057 · 117 employers |
| Median days open | 12 d | 33 d (−21 d vs this employer) |
| Median salary (USD postings) | — | $186k |
Skills observed across this category: manual assembly, rework of multi-chip modules, automated test benches, RF tests, IC Package assembly, component soldering
Who's hiring in this category
- Infineon Technologies · 36 open roles · median 21 d
- Renesas Electronics · 32 open roles · median 28 d
- Micron Technology · 18 open roles · median 50 d
- onsemi · 17 open roles · median 41 d
- STMicroelectronics · 16 open roles · median 17 d
- SanDisk · 14 open roles · median 9 d
How we counted: 279 open Packaging Engineering (Packaging) roles from 46 employers tracked in the SemiconductorJobs index, counted 8 Nov 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.