$74,000 - $147,200 USD yearly
About the role
Skyworks is searching for a Process Development Engineer in Richardson, TX to develop and optimize SMT, semiconductor packaging, and advanced assembly processes.
What you'll do
- Develop and optimize SMT, semiconductor packaging, and advanced assembly processes.
- Support volume production and New Product Introduction (NPI) manufacturing for surface mount electronics (SMT), Flip Chip Attach, and Die Attach.
- Lead process characterization, DOE execution, and process window development.
- Evaluate new equipment, processes, and materials, and generate post-build and DFM reports.
- Monitor product yields daily, initiate corrective actions, and drive 5S and process improvement initiatives.
- Develop process documentation, work instructions, control plans, and manufacturing standards while mentoring technicians and operators.
What you'll need
- Bachelor's degree in Mechanical, Electrical, Manufacturing, Material Engineering, or a related discipline (or Master's degree).
- 2+ years of industry experience, or a Master's degree accepted in lieu of industry experience (0+ years with Master's degree).
- Experience developing and optimizing SMT, Flip Chip Attach, or Die Attach packaging processes.
- Demonstrated capability with process characterization, DOE execution, and process window development.
Nice to have
- Master's degree in Mechanical, Electrical, Manufacturing, or Material Engineering.
- Experience in a mid to high-volume manufacturing environment.
- Semiconductor assembly experience with high-density fine-pitch components (BGA, LGA, QFN, 0201, 01005).
- Experience with reflow, pick and place, and solder paste printing.
- Experience with SPC techniques, Lean practices, and knowledge of the IPC-A-610 standard.
Skills: SMT, Flip Chip, Die Attach, BGA, Packaging Assembly
More semiconductor jobs: Packaging engineer jobs
This role has been open 9 days — well below the 33-day median for Packaging Engineering roles.
Packaging Engineering · Packaging
|
Open roles in category
279
|
Median days open
33 d
|
Category median salary (all employers)
$186k
|
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
| Metric | Skyworks | All employers we track in this specialty (279 roles · 46 employers) |
|---|---|---|
| Open roles in this specialty | 11 | 279 |
| Open roles in the wider Process, Fab & Equipment family | 153 | 10057 · 117 employers |
| Median days open | 12 d | 33 d (−21 d vs this employer) |
| Median salary (USD postings) | — | $186k |
Skills observed across this category: SMT, Flip Chip, Die Attach, BGA, Packaging Assembly
Who's hiring in this category
- Infineon Technologies · 36 open roles · median 21 d
- Renesas Electronics · 32 open roles · median 28 d
- Micron Technology · 18 open roles · median 50 d
- onsemi · 17 open roles · median 41 d
- STMicroelectronics · 16 open roles · median 17 d
- SanDisk · 14 open roles · median 9 d
How we counted: 279 open Packaging Engineering (Packaging) roles from 46 employers tracked in the SemiconductorJobs index, counted 8 Nov 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.