$129,400 - $247,800 USD yearly
About the role
As a Principal Packaging Engineer, you will support new product development (NPI) of RF System in Package (SiP) modules using advanced laminate packaging technologies. You will serve as the packaging interface between cross-functional teams and internal/external manufacturing.
What you'll do
- Collaborate with IC design teams to define and implement package requirements.
- Maintain ownership of specific products from the feasibility stage through to high-volume production.
- Implement DFM and BKM practices to optimize assembly yield, cost, and reliability.
- Develop new assembly technologies, execute process DOEs, evaluate materials and equipment, conduct reliability testing, and qualify new assembly processes.
What you'll need
- BS degree in Electrical Engineering, Mechanical Engineering, Process Engineering, or Material Science with a minimum of 12 years of semiconductor packaging experience (or MS with 8 years).
- Expertise in overmolded laminate module packaging processes, including SMT, Wirebonding, Die Attach, and Molding.
- Knowledge of assembly processes including Flip Chip Bumping, Fan Out, WLCSP, BGA, Module Level Shielding, and IPDs.
- Experience with advanced RF SiP modules, including Dual Side BGA, Dual Side Mold Grid Array, and EMI Shielding.
- Demonstrated experience collaborating with OSAT assembly factories in Asia.
Nice to have
- Experience in package design using Cadence Allegro platform tools (PCB Editor, Advanced Package Designer, APD/SiP) or Mentor Xpedition platform tools.
- Hands-on experience with assembly processes, equipment, and Failure Analysis.
- Understanding of RF products, organic laminate technology manufacturing, and Lead-Frame Packaging.
- Understanding of module and board-level reliability requirements alongside advanced packaging R&D experience.
Skills: advanced laminate packaging, RF System in Package (SiP), assembly yield, overmolded laminate, Flip Chip Bumping, Fan Out
More semiconductor jobs: Packaging engineer jobs · San Jose jobs
This role has been open 228 days — well above the 33-day median for Packaging Engineering roles.
Packaging Engineering · Packaging
|
Open roles in category
279
|
Median days open
33 d
|
Category median salary (all employers)
$186k
|
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
| Metric | Skyworks | All employers we track in this specialty (279 roles · 46 employers) |
|---|---|---|
| Open roles in this specialty | 11 | 279 |
| Open roles in the wider Process, Fab & Equipment family | 153 | 10057 · 117 employers |
| Median days open | 12 d | 33 d (−21 d vs this employer) |
| Median salary (USD postings) | — | $186k |
Skills observed across this category: advanced laminate packaging, RF System in Package (SiP), assembly yield, overmolded laminate, Flip Chip Bumping, Fan Out
Who's hiring in this category
- Infineon Technologies · 36 open roles · median 21 d
- Renesas Electronics · 32 open roles · median 28 d
- Micron Technology · 18 open roles · median 50 d
- onsemi · 17 open roles · median 41 d
- STMicroelectronics · 16 open roles · median 17 d
- SanDisk · 14 open roles · median 9 d
How we counted: 279 open Packaging Engineering (Packaging) roles from 46 employers tracked in the SemiconductorJobs index, counted 8 Nov 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.