Principal Engineer, Software Engineering
Originally posted 10 November 2026 by the employer.
About the role
Provide technical leadership in developing the software that directly powers semiconductor equipment combining robotics, motion control, thermal systems, and process intelligence. The focus includes software for advanced packaging and hybrid bonding equipment.
What you'll do
- Provide technical leadership for the design, development, integration, and delivery of software for advanced packaging and hybrid bonding equipment.
- Drive hands-on C++ design, implementation, troubleshooting, code reviews, and software architecture decisions supporting scalability, maintainability, and performance.
- Lead technically complex software features and subsystems from requirements through implementation, integration, validation, and release.
- Work cross-functionally with process engineering, hardware engineering, controls, and system integration teams to deliver integrated equipment software.
- Diagnose and resolve software and system-level problems involving interactions between software, hardware, robotics, motion control, and process systems.
- Mentor software engineers and support software baseline management, release planning, configuration management, and version control.
What you'll need
- Bachelor’s or Master’s degree in Computer Science, Software Engineering, Computer Engineering, or a related field.
- 8+ years of relevant software development experience, with demonstrated technical leadership in complex software systems.
- Strong hands-on software development expertise in C++.
- Experience developing software that interacts with complex hardware, equipment, robotics, motion control, automation, or other real-time systems.
- Exposure to advanced packaging process flows such as CoWoS, SoIC, or InFO.
- Proven experience with customer-oriented software baseline management and release planning.
More semiconductor jobs: ASM International jobs · Packaging engineer jobs
First seen in our index 0 days ago, well below the 61-day median for Packaging Engineering roles.
Packaging Engineering · Advanced Packaging
|
Open roles in category
323
|
Median days since first seen
61 d
|
Category median salary (all employers)
$167k
|
See the full market breakdown ▾Category comparison, and who else is hiring
| Metric | ASM International | All employers we track in this specialty (323 roles · 65 employers) |
|---|---|---|
| Open roles in this specialty | 9 | 323 |
| Open roles in the wider Process, Fab & Equipment family | 285 | 10205 · 116 employers |
| Median days since first seen | 76 d | 61 d (−15 d vs this employer) |
| Median salary (USD postings) | n/a | $167k |
Who's hiring in this category
- Micron Technology · 42 open roles · median 56 d
- KLA Corporation · 40 open roles · median 152 d
- Intel Corporation · 23 open roles · median 32 d
- Renesas Electronics · 23 open roles · median 34 d
- Lumilens · 13 open roles · median 95 d
- Infineon Technologies · 11 open roles · median 51 d
How we counted: 323 open Packaging Engineering (Advanced Packaging) roles from 65 employers tracked in the SemiconductorJobs index, counted 10 Nov 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there, and is counted in the wider Process, Fab & Equipment family row. Days are counted from when our index first saw each posting, not from the employer's original posting date.