Principal Engineer Package Concept (Module)
$156,900 - $215,700 USD yearly
Define package concepts and hardware demonstrators for AI power supply products and high-performance computing modules.
Originally posted 14 May 2026 by the employer. Relisted by the employer on 4 November 2026.
About the role
Define package concepts for AI power supply products with a focus on high-performance computing modules. The position guides module concepts through simulation, hardware demonstrators, and assembly project execution in cooperation with Back End development and OSAT partners.
What you'll do
- Define package concepts for AI power supply products focusing on high-performance computing modules.
- Validate package concepts through simulation and hardware demonstrators in cooperation with Back End development, product development, and system architects.
- Align concepts with internal Back End development and OSAT partners, and initiate assembly projects.
- Support package development projects through final product release.
- Identify new development topics and incorporate them into the package roadmap.
- Provide technical packaging support directly to customers, and track industry solutions through market screening and competitor analysis.
What you'll need
- Degree in Physics, Electronics, or a related technical discipline.
- 6 years practical experience in assembly technologies with detailed knowledge of Back End processes, materials, and laminate design, materials, and process dependencies.
- Background knowledge of SMT related technologies.
- Experience with package design tools such as Autocad or Cadence.
- Strong communication and presentation skills.
Skills: package concepts, AI power supply products, high-performance computing modules, simulation, hardware demonstrators, Back End development, assembly projects, package roadmap, Autocad, Cadence
More semiconductor jobs: Infineon Technologies jobs · Packaging engineer jobs
This role has been open 210 days — well above the 40-day median for Packaging Engineering roles.
Packaging Engineering · Packaging
|
Open roles in category
267
|
Median days open
40 d
|
Category median salary (all employers)
$182k
|
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
| Metric | Infineon Technologies | All employers we track in this specialty (267 roles · 46 employers) |
|---|---|---|
| Open roles in this specialty | 28 | 267 |
| Open roles in the wider Process, Fab & Equipment family | 299 | 10085 · 116 employers |
| Median days open | 47 d | 40 d (+7 d vs this employer) |
| Median salary (USD postings) | — | $182k |
Skills observed across this category: package concepts, AI power supply products, high-performance computing modules, simulation, hardware demonstrators, Back End development
Who's hiring in this category
- Renesas Electronics · 32 open roles · median 42 d
- Infineon Technologies (this employer) · 27 open roles · median 42 d
- Micron Technology · 19 open roles · median 50 d
- onsemi · 18 open roles · median 36 d
- STMicroelectronics · 15 open roles · median 14 d
- Skyworks · 14 open roles · median 10 d
How we counted: 267 open Packaging Engineering (Packaging) roles from 46 employers tracked in the SemiconductorJobs index, counted 4 Nov 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.