About the role
Lyte AI is seeking a process lead/manager focused on optical sensor device packaging and contract manufacturing.
What you'll do
- Lead the NPI process team across wafer, device packaging, and PCBA assembly process optimization and yield improvement via material selection, process refinement, and DOE.
- Interface with R&D to align on design targets, specifications, process flow, and yield implications across process steps.
- Partner with wafer foundries and OSATs to support NPI and volume production contract manufacturing.
- Provide DFM, DFR, and DFT inputs to R&D teams for device tapeout and packaging during the design phase.
- Perform process integration checks, audit contract manufacturers and suppliers, and author technical SOWs and reports.
- Drive Cp, Cpk, and yield improvement metrics while growing the operation process team.
What you'll need
- Master's or Ph.D. degree in Electrical Engineering, Photonics, Mechanical Engineering, Physics, or a related field with at least 8 years of relevant experience.
- Hands-on experience in microelectronic and optical devices packaging.
- Background in process integration for process flow design and continuous process improvement.
- Experience working with foundries, OSATs, PCBA fabs, and contract manufacturers in process development and yield improvement.
- Proven experience with FMEA, failure analysis, and 8D reports.
- Demonstrated project management capability.
Nice to have
- Experience with process flow design, SPC, Six Sigma, Lean manufacturing continuous improvement, and material staging concepts.
- Familiarity with data analysis software such as JMP.
- Knowledge of wafer level processes including lithography, thin film, plating, and DIE/DRIE.
- Experience with PCBA processes, III-V wafer processes, bar level processes, and CoC packaging.
- Understanding of silicon photonics, lidar technologies, and supplier quality management.
- Familiarity with ECN, PCN, and documentation practices.
Skills: Packaging, Assembly lead, custom silicon
More semiconductor jobs: Packaging engineer jobs · Sunnyvale jobs
This role has been open 135 days — well above the 33-day median for Packaging Engineering roles.
Packaging Engineering · Packaging
|
Open roles in category
279
|
Median days open
33 d
|
Category median salary (all employers)
$186k
|
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
| Metric | Lyte AI | All employers we track in this specialty (279 roles · 46 employers) |
|---|---|---|
| Open roles in this specialty | 4 | 279 |
| Open roles in the wider Process, Fab & Equipment family | 5 | 10057 · 117 employers |
| Median days open | 135 d | 33 d (+102 d vs this employer) |
| Median salary (USD postings) | — | $186k |
Skills observed across this category: Packaging, Assembly lead, custom silicon
Who's hiring in this category
- Infineon Technologies · 36 open roles · median 21 d
- Renesas Electronics · 32 open roles · median 28 d
- Micron Technology · 18 open roles · median 50 d
- onsemi · 17 open roles · median 41 d
- STMicroelectronics · 16 open roles · median 17 d
- SanDisk · 14 open roles · median 9 d
How we counted: 279 open Packaging Engineering (Packaging) roles from 46 employers tracked in the SemiconductorJobs index, counted 8 Nov 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.