About the role
AMD is hiring an MTS Systems Design Engineer to integrate silicon devices into products and develop server solutions at the rack and datacenter level. The role encompasses pre-silicon mechanical definition, package technology development, and cooling design solutions.
What you'll do
- Define and design mechanical features and develop package technology for semiconductor products.
- Design and implement cooling design solutions for server solutions at the rack and datacenter level.
- Conduct mechanical modeling and tolerance analysis, including structural and statistical analysis.
- Develop server-level architecture and systems, designing and characterizing customer and reference systems.
- Plan and execute thermal mechanical testing, then characterize and analyze resulting data.
What you'll need
- Master's degree in Mechanical Engineering, Computer Engineering, Electrical Engineering, or related field with 3 years of engineering experience (or a Bachelor's degree with 5 years of progressive post-baccalaureate experience).
- 3 years of experience with product development cycles and developing mechanical solutions at the silicon, package, and system level.
- 3 years of experience using Solidworks and Creo CAD.
- 3 years of experience in structural aspects of mechanical design, including statistical analysis, structural analysis, Finite Element Analysis, and tolerance analysis.
- 3 years of experience applying Design for Manufacturing and Assembly principles.
- 3 years of experience conducting thermal mechanical testing.
Skills: Solidworks, Creo CAD, FEA, thermal mechanical testing, DFMA
More semiconductor jobs: AMD jobs · Packaging engineer jobs · Texas jobs
This role has been open 0 days — well below the 34-day median for Packaging Engineering roles.
Packaging Engineering · Packaging
|
Open roles in category
284
|
Median days open
34 d
|
Category median salary (all employers)
$186k
|
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
| Metric | AMD | All employers we track in this specialty (284 roles · 46 employers) |
|---|---|---|
| Open roles in this specialty | 5 | 284 |
| Open roles in the wider Process, Fab & Equipment family | 51 | 10131 · 117 employers |
| Median days open | 32 d | 34 d (−2 d vs this employer) |
| Median salary (USD postings) | — | $186k |
Skills observed across this category: Solidworks, Creo CAD, FEA, thermal mechanical testing, DFMA
Who's hiring in this category
- Infineon Technologies · 36 open roles · median 19 d
- Renesas Electronics · 35 open roles · median 42 d
- Micron Technology · 18 open roles · median 48 d
- onsemi · 17 open roles · median 39 d
- STMicroelectronics · 16 open roles · median 15 d
- Skyworks · 14 open roles · median 12 d
How we counted: 284 open Packaging Engineering (Packaging) roles from 46 employers tracked in the SemiconductorJobs index, counted 6 Nov 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.