$163,000 - $224,000 USD yearly
Originally posted 6 November 2026 by the employer.
About the role
Applied Materials is seeking a Sr MTS Electrical Engineer to lead and execute complex technology and engineering projects. In this role, you will drive electrical design for System on Wafer (SOW) technology development and support external client products.
What you'll do
- Drive electrical design for SOW technology development and external client products.
- Spearhead modeling, simulation, measurement, and correlation efforts across electrical systems.
- Support electrical performance-driven PDK development and CAD tool flows to enable SOW technology for customers.
- Interface with internal and external customers regarding complex electrical issues to address High Value Problems (HVP).
- Specify engineering analysis, layout/schematics, detailed specifications, and engineering assemblies.
- Design, perform, collect data, and document unusually complex engineering experiments and tests.
What you'll need
- Expertise in electrical design for SOW technology and product development.
- Hands-on experience with modeling, simulation, measurement, and correlation efforts.
- Experience with electrical performance-driven PDK development and CAD tool flows.
- Proven track record of generating product specifications, schematics, and engineering layouts.
- Track record of technical contributions, inventions, patents, or published papers.
Skills: System on Wafer, electrical design, modeling and simulation, PDK development, CAD flow
More semiconductor jobs: Applied Materials jobs · Advanced packaging jobs · Santa Clara jobs
This role has been open 0 days — well below the 91-day median for Chiplet/Advanced Packaging Design roles.
Chiplet/Advanced Packaging Design · Chiplet Interconnect
|
Open roles in category
43
|
Median days open
91 d
|
Category median salary (all employers)
$222k
|
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
| Metric | Applied Materials | All employers we track in this specialty (43 roles · 18 employers) |
|---|---|---|
| Open roles in this specialty | 2 | 43 |
| Median days open | 68 d | 91 d (−23 d vs this employer) |
| Median salary (USD postings) | — | $222k |
Skills observed across this category: System on Wafer, electrical design, modeling and simulation, PDK development, CAD flow
Who's hiring in this category
- Marvell Technology · 7 open roles · median 44 d
- Micron Technology · 5 open roles · median 156 d
- AMD · 4 open roles · median 49 d
- Intel Corporation · 4 open roles · median 50 d
- NVIDIA · 4 open roles · median 85 d
- Qualcomm · 4 open roles · median 121 d
How we counted: 43 open Chiplet/Advanced Packaging Design (Chiplet Interconnect) roles from 18 employers tracked in the SemiconductorJobs index, counted 6 Nov 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there. Figures refresh nightly.