MASTERS FRESH GRAD - Packaging Engineering
Originally posted 7 July 2026 by the employer.
About the role
This role involves developing manufacturing processes for NPI, transferring them to HVM, and building factory automation solutions. You will work on process optimization, SECS/GEM equipment integration, and statistical data analysis.
What you'll do
- Develop new processes for NPI and transfer them to HVM without major quality issues.
- Analyze and optimize existing manufacturing processes to enhance efficiency and product quality using Six Sigma and Lean methodologies.
- Design and conduct experiments to troubleshoot process issues and validate improvements.
- Develop and maintain factory automation applications with modern frontend tools.
- Develop and optimize Oracle SQL and Microsoft SQL Server queries for data access and reporting.
- Integrate factory systems and manufacturing equipment via web services, API calls, or SECS/GEM communication protocols.
- Support fine-tuning of pre-trained models on domain-specific datasets, software testing, and system troubleshooting during production ramp-up.
What you'll need
- Masters or Degree in Mechatronic Engineering, Computer Engineering, Computer Science, Software Engineering, Electrical Engineering, Data Science, Artificial Intelligence, Machine Learning, or a related technical field.
- Proficiency in statistical data analysis and process simulation software.
- Knowledge of statistical techniques in data science such as regression and properties of distribution.
- Knowledge of machine learning techniques including neural networks.
- Knowledge of programming languages such as Python or R, and SQL databases for data mining and analysis.
- Experience or academic projects related to manufacturing automation, MES integration, or factory data systems.
- Exposure to Industry 4.0 technologies, real-time dashboards, or digital transformation initiatives in manufacturing.
Skills: packaging process, NPI, HVM, Six Sigma, SECS/GEM, factory automation
More semiconductor jobs: SanDisk jobs · Packaging engineer jobs · Malaysia jobs
This role has been open 0 days — well below the 46-day median for Packaging Engineering roles.
Packaging Engineering · Packaging
|
Open roles in category
250
|
Median days open
46 d
|
Category median salary (all employers)
$166k
|
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
| Metric | SanDisk | All employers we track in this specialty (250 roles · 45 employers) |
|---|---|---|
| Open roles in this specialty | 6 | 250 |
| Open roles in the wider Process, Fab & Equipment family | 73 | 10091 · 105 employers |
| Median days open | 0 d | 46 d (−46 d vs this employer) |
| Median salary (USD postings) | — | $166k |
Skills observed across this category: packaging process, NPI, HVM, Six Sigma, SECS/GEM, factory automation
Who's hiring in this category
- Renesas Electronics · 31 open roles · median 39 d
- Infineon Technologies · 26 open roles · median 42 d
- Micron Technology · 20 open roles · median 79 d
- onsemi · 15 open roles · median 35 d
- Skyworks · 15 open roles · median 3 d
- Intel Corporation · 12 open roles · median 71 d
How we counted: 250 open Packaging Engineering (Packaging) roles from 45 employers tracked in the SemiconductorJobs index, counted 30 Oct 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.