Intern Assembly Process Engineering - Muar, Malaysia
Originally posted 26 October 2026 by the employer.
Focus on semiconductor assembly processes covering SAW, die attach (DA), wire bonding (WB), and molding.
About the role
As an Assembly Process Engineering Intern, you will work with engineers on projects and activities related to semiconductor assembly processes. Your scope includes SAW, die attach (DA), wire bonding (WB), and molding operations.
What you'll do
- Support process-sustaining and improvement activities to enhance quality and yield, and reduce customer complaints and hold lots.
- Support production teams in achieving WWS targets.
- Monitor process performance to ensure operation remains within established SPC control limits.
- Prepare and update process documentation, including specifications, standard operating procedures (SOPs), FMEAs, and process control plans.
- Provide technical support during investigations of critical quality issues related to materials or processes.
- Follow company policies and requirements related to safety, quality, and confidentiality.
What you'll need
- Currently pursuing a Bachelor’s or Master’s Degree in Mechanical Engineering, Materials Science, Electrical Engineering, Electronics Engineering, or a related engineering discipline.
- Proficiency in Microsoft Office, particularly Microsoft Excel.
- Strong analytical and problem-solving skills for technical investigations in a manufacturing environment.
- Ability to manage documentation such as SOPs, FMEAs, and process control plans.
Skills: assembly, SPC, FMEA, process sustaining, continuous improvement
More semiconductor jobs: Packaging engineer jobs · Malaysia jobs
This role has been open 0 days — well below the 48-day median for Packaging Engineering roles.
Packaging Engineering · Packaging
|
Open roles in category
242
|
Median days open
48 d
|
Median salary
$166k
|
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
| Metric | STMicroelectronics | All employers we track in this specialty (242 roles · 44 employers) |
|---|---|---|
| Open roles in this specialty | 10 | 242 |
| Open roles in the wider Process, Fab & Equipment family | 279 | 10323 · 107 employers |
| Median days open | 20 d | 48 d (−28 d vs this employer) |
| Median salary (USD postings) | — | $166k |
Skills observed across this category: assembly, SPC, FMEA, process sustaining, continuous improvement
Who's hiring in this category
- Renesas Electronics · 30 open roles · median 41 d
- Infineon Technologies · 26 open roles · median 41 d
- Micron Technology · 20 open roles · median 78 d
- onsemi · 16 open roles · median 34 d
- Skyworks · 15 open roles · median 2 d
- Intel Corporation · 11 open roles · median 113 d
How we counted: 242 open Packaging Engineering (Packaging) roles from 44 employers tracked in the SemiconductorJobs index, counted 29 Oct 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.