Associate Process Engineer (Die Prep)
Originally posted 21 October 2026 by the employer.
About the role
The Associate Process Engineer develops, sustains, optimizes, and troubleshoots manufacturing processes to achieve quality, yield, cost, reliability, and productivity targets. The role drives process stability and technical support for die prep operations within the manufacturing environment.
What you'll do
- Own and support assigned manufacturing processes, monitoring process performance, yield, quality, and productivity metrics.
- Drive yield improvement and defect reduction activities by performing commonality analysis across product, process, machine, material, and measurement factors.
- Lead structured root cause investigations and execute corrective actions using 8D, DMAIC, FMEA, and SPC/APC analysis.
- Identify and implement cost reduction opportunities while improving equipment utilization, throughput, and manufacturing efficiency.
- Conduct risk assessments for process changes and maintain compliance with quality, safety, and manufacturing standards.
- Collaborate with Manufacturing, Quality, Equipment Engineering, Failure Analysis, Production, and NPI teams to resolve technical issues.
What you'll need
- Bachelor's Degree in Engineering (Mechanical, Electrical, Electronics, Manufacturing, Materials, or equivalent); fresh graduates are welcome to apply.
- Knowledge of manufacturing process control, SPC, FMEA, DOE, and statistical analysis.
- Experience or academic training in process improvement, yield enhancement, defect reduction, and productivity improvement.
- Practical understanding of root cause analysis and problem-solving methodologies including 8D, 5 Why, Fishbone, and DMAIC.
- Understanding of quality systems, manufacturing standards, and cross-functional collaboration with Production, Equipment, and Quality teams.
- Technical documentation skills and ability to drive corrective actions to closure.
Nice to have
- Degree or Master’s Degree in Engineering or a related field.
- Experience in semiconductor backend assembly, die preparation, die attach, wire bond, molding, singulation, AOI, or test.
- Experience with automation, machine learning applications, APC, Industry 4.0 initiatives, or digital transformation projects.
- Knowledge of reliability testing and failure analysis techniques.
- Familiarity with SAP, MES, JMP, Minitab, Power BI, Tableau, or similar analytical tools.
- Certified Six Sigma Green Belt or Black Belt.
Skills: Die Prep, Die Attach, SPC, FMEA, Yield Improvement
More semiconductor jobs: SanDisk jobs · Packaging engineer jobs · Malaysia jobs
This role has been open 0 days — well below the 46-day median for Packaging Engineering roles.
Packaging Engineering · Packaging
|
Open roles in category
250
|
Median days open
46 d
|
Category median salary (all employers)
$166k
|
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
| Metric | SanDisk | All employers we track in this specialty (250 roles · 45 employers) |
|---|---|---|
| Open roles in this specialty | 6 | 250 |
| Open roles in the wider Process, Fab & Equipment family | 73 | 10091 · 105 employers |
| Median days open | 0 d | 46 d (−46 d vs this employer) |
| Median salary (USD postings) | — | $166k |
Skills observed across this category: Die Prep, Die Attach, SPC, FMEA, Yield Improvement
Who's hiring in this category
- Renesas Electronics · 31 open roles · median 39 d
- Infineon Technologies · 26 open roles · median 42 d
- Micron Technology · 20 open roles · median 79 d
- onsemi · 15 open roles · median 35 d
- Skyworks · 15 open roles · median 3 d
- Intel Corporation · 12 open roles · median 71 d
How we counted: 250 open Packaging Engineering (Packaging) roles from 45 employers tracked in the SemiconductorJobs index, counted 30 Oct 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.