About the role
As an Assembly Build Technician, you will support engineering activities in the assembly of prototype semiconductor devices, including the fabrication, modification, and assembly of prototype systems, experimental design circuitry, or specialized equipment.
What you'll do
- Build prototype semiconductor parts using assembly equipment and tools such as SMT machines, reflow ovens, dicing equipment, die attach, wire bond, mold, laser marking, strip grinders, and sputtering machines.
- Participate in daily updates and exchange information during operational meetings.
- Ensure ESD protocols are met and monitor active compliance.
What you'll need
- An Associate degree or equivalent years of experience with at least 2 years of relevant experience.
- Ability to perform manual soldering techniques under a microscope with small components.
- Working knowledge of semiconductor assembly tools, including SMT, die attach, wire bond, mold, laser mark, singulation, strip grinder, or sputter machines.
- Proficiency using computers with working knowledge of MS Office applications.
- Strong communication skills with the ability to follow verbal and written instructions.
Nice to have
- Knowledge of different electronic components.
- Experience in manual soldering techniques of microscopic parts.
- Willingness to work extended hours and weekends as necessary.
Skills: SMT, die attach, wire bond, reflow oven, sputtering
More semiconductor jobs: Packaging engineer jobs · California jobs
This role has been open 16 days — well below the 33-day median for Packaging Engineering roles.
Packaging Engineering · Packaging
|
Open roles in category
279
|
Median days open
33 d
|
Category median salary (all employers)
$186k
|
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
| Metric | Skyworks | All employers we track in this specialty (279 roles · 46 employers) |
|---|---|---|
| Open roles in this specialty | 11 | 279 |
| Open roles in the wider Process, Fab & Equipment family | 153 | 10057 · 117 employers |
| Median days open | 12 d | 33 d (−21 d vs this employer) |
| Median salary (USD postings) | — | $186k |
Skills observed across this category: SMT, die attach, wire bond, reflow oven, sputtering
Who's hiring in this category
- Infineon Technologies · 36 open roles · median 21 d
- Renesas Electronics · 32 open roles · median 28 d
- Micron Technology · 18 open roles · median 50 d
- onsemi · 17 open roles · median 41 d
- STMicroelectronics · 16 open roles · median 17 d
- SanDisk · 14 open roles · median 9 d
How we counted: 279 open Packaging Engineering (Packaging) roles from 46 employers tracked in the SemiconductorJobs index, counted 8 Nov 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.