Support microLED-based optical interconnect fabrication utilizing flip chip bonding, underfill dispense, and profilometry.
About the role
As a process technician in the clean room, you will perform technical tests and experiments for engineering in the wafer fabrication area. You will support process development, test new products, and handle the disposition of production material.
What you'll do
- Perform technical tests, experiments, and product testing in the wafer fabrication clean room.
- Provide technical assistance and process support to process development and engineering personnel.
- Interface and communicate across fab engineering and manufacturing groups to resolve issues.
- Address production concerns and handle the disposition of production material.
- Support overall fab performance by learning process flows quickly and executing designated tasks.
What you'll need
- AA degree or 4 years of experience in a cleanroom fab.
- Experience with Flip Chip Bonding, flux dispense, underfill dispense, profilometry, optical microscope inspection, and related operations.
- Proficiency with MS Office, Word, and Excel.
- Comfort working in a clean room environment.
Nice to have
- Familiarity with probe stations and experience with electrical test.
- Experience operating lasers and adhering to related safety protocols.
Skills: clean room, flip chip bonding, underfill dispense, profilometry, wafer fabrication
More semiconductor jobs: Packaging engineer jobs · Sunnyvale jobs
This role has been open 4 days — well below the 59-day median for Packaging Engineering roles.
Packaging Engineering · Advanced Packaging
|
Open roles in category
321
|
Median days open
59 d
|
Category median salary (all employers)
$167k
|
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
| Metric | Avicena | All employers we track in this specialty (321 roles · 65 employers) |
|---|---|---|
| Open roles in this specialty | 2 | 321 |
| Open roles in the wider Process, Fab & Equipment family | 22 | 10057 · 117 employers |
| Median days open | 4 d | 59 d (−55 d vs this employer) |
| Median salary (USD postings) | — | $167k |
Skills observed across this category: clean room, flip chip bonding, underfill dispense, profilometry, wafer fabrication
Who's hiring in this category
- Micron Technology · 42 open roles · median 54 d
- KLA Corporation · 40 open roles · median 150 d
- Intel Corporation · 23 open roles · median 30 d
- Renesas Electronics · 22 open roles · median 25 d
- Lumilens · 13 open roles · median 93 d
- Infineon Technologies · 11 open roles · median 49 d
How we counted: 321 open Packaging Engineering (Advanced Packaging) roles from 65 employers tracked in the SemiconductorJobs index, counted 8 Nov 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.