Originally posted 4 November 2026 by the employer.
About the role
This role owns assembly and test yield for an advanced packaging platform from NPI through high-volume manufacturing, acting as the single point of accountability across OSAT partners, foundry partners, and internal engineering teams. The scope spans 2.5D/3D/3.5D heterogeneous integration, fan-out, and silicon bridge technologies.
What you'll do
- Own packaging yield for a portfolio of advanced packaging products from NPI through ramp to high-volume manufacturing.
- Lead technical engagement with OSAT and foundry partners to set yield targets, run joint yield reviews, and drive corrective actions to closure.
- Drive root cause analysis on yield issues using detection, bin analysis, inline and equipment data, and failure analysis against a target of less than or equal to one day to first actionable insight.
- Build and maintain root cause Paretos for each product and drive the top contributors to closure with manufacturing partners.
- Publish a weekly yield report and lead yield reviews with Business Unit, Product Engineering, and partner leadership.
- Define data-readiness requirements, including yield data feeds and die-level traceability, with OSAT and foundry partners prior to each product's first build.
What you'll need
- BS, MS, or PhD in EE, ME, Materials, Chemical Engineering, or a related field.
- Experience with semiconductor packaging, assembly, or test yield.
- Technical background in root cause analysis spanning bin analysis, inline and equipment data, and failure analysis.
- Experience managing technical engagements and joint yield reviews with OSAT and foundry partners.
Nice to have
- Hands-on yield ramp experience in advanced packaging: 2.5D/3D/3.5D heterogeneous integration, fan-out, silicon bridge, or hybrid bonding.
- Strong SQL and Python skills with experience working directly in large manufacturing data sets such as Snowflake.
- Experience with partner data systems, including B2B feeds, STDF (standard test data format), and die-level traceability.
- Familiarity with AI or agentic tools in engineering analysis.
- Experience across multiple product segments including client, server, and data center.
More semiconductor jobs: AMD jobs · Packaging engineer jobs · Texas jobs
This role has been open 0 days — well below the 61-day median for Packaging Engineering roles.
Packaging Engineering · Advanced Packaging
|
Open roles in category
307
|
Median days open
61 d
|
Category median salary (all employers)
$167k
|
See the full market breakdown ▾Category comparison, and who else is hiring
| Metric | AMD | All employers we track in this specialty (307 roles · 63 employers) |
|---|---|---|
| Open roles in this specialty | 8 | 307 |
| Open roles in the wider Process, Fab & Equipment family | 52 | 10099 · 116 employers |
| Median days open | 56 d | 61 d (−5 d vs this employer) |
| Median salary (USD postings) | — | $167k |
Who's hiring in this category
- Micron Technology · 41 open roles · median 50 d
- KLA Corporation · 40 open roles · median 146 d
- Intel Corporation · 20 open roles · median 48 d
- Renesas Electronics · 18 open roles · median 42 d
- Lumilens · 13 open roles · median 89 d
- onsemi · 12 open roles · median 49 d
How we counted: 307 open Packaging Engineering (Advanced Packaging) roles from 63 employers tracked in the SemiconductorJobs index, counted 4 Nov 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.