VP, Advanced Packaging Technology Lead - Tempe, AZ, United States
Originally posted 24 September 2026 by the employer.
About the role
This role leads the strategy, development, and commercialization of advanced IC packaging solutions reporting into the Chiplets/FCBGA Business Unit. The position serves as an interface between business unit leadership, factory operations, Tier 1 customers, and R&D teams in South Korea to drive technology roadmaps and execution.
What you'll do
- Lead and coordinate advanced packaging development activities with customers and engineering teams to align with business objectives, technology roadmaps, and market requirements. - Drive strategic engagement with Tier 1 customers, including roadmap discussions, executive reviews, technology planning, and development program oversight for advanced packaging products. - Collaborate across engineering, operations, manufacturing, sales, and R&D organizations to execute and commercialize packaging technologies. - Serve as a key liaison between the Chiplets/FCBGA Business Unit, factory operations, and global R&D teams to support technology transfer and manufacturing readiness. - Maintain ownership of product strategy and development through qualification, initial production ramp, and sustained business growth. - Lead cross-functional decision-making, risk management, and resource alignment to achieve program, customer, and business objectives.
What you'll need
- Bachelor's degree in Engineering (Materials Science, Mechanical, Electrical, or Chemical), or 13+ years of experience with a Master's degree. - 15+ years of experience in semiconductor packaging development. - Demonstrated experience leading advanced IC packaging development initiatives within a global organization. - Comprehensive understanding of the IC package design environment and trade-offs associated with package design during package process development. - Deep knowledge of IC packaging materials, failure modes, and reliability qualification procedures. - Ability to support 20% domestic and 20% international travel.
Nice to have
- Working knowledge of heterogeneous packaging and trade-offs between IC packaging technologies. - Knowledge of thermal and mechanical simulations, modeling, and performance optimization techniques. - Familiarity with Design of Experiments (DOE), Statistical Process Control (SPC), and product positioning or marketing support activities. - Knowledge of fault isolation and failure analysis techniques. - Experience translating customer product roadmaps into advanced IC packaging technology roadmaps. - Familiarity with advanced packaging applications supporting AI, high-performance computing, and networking.
Skills: advanced packaging, chiplets, FCBGA, heterogeneous packaging, reliability qualification
This role has been open 0 days — well below the 50-day median for Chiplet/Advanced Packaging Design roles.
Chiplet/Advanced Packaging Design · Advanced Packaging
|
Open roles in category
72
|
Median days open
50 d
|
Median salary
$167k
|
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
| Metric | Amkor | All employers we track in this specialty (72 roles · 25 employers) |
|---|---|---|
| Open roles in this specialty | 2 | 72 |
| Median days open | 0 d | 50 d (−50 d vs this employer) |
| Median salary (USD postings) | — | $167k |
Skills observed across this category: advanced packaging, chiplets, FCBGA, heterogeneous packaging, reliability qualification
Who's hiring in this category
- AMD · 11 open roles · median 51 d
- Micron Technology · 9 open roles · median 180 d
- NVIDIA · 7 open roles · median 29 d
- Marvell Technology · 6 open roles · median 25 d
- Broadcom · 4 open roles · median 150 d
- GlobalFoundries · 4 open roles · median 118 d
How we counted: 72 open Chiplet/Advanced Packaging Design (Advanced Packaging) roles from 25 employers tracked in the SemiconductorJobs index, counted 28 Oct 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there. Figures refresh nightly.