Process Development Engineering Intern - Morgan Hill, CA, United States
Originally posted 2 October 2026 by the employer.
About the role
MACOM is seeking a Process Development Engineering Intern to develop backend assembly processes and package developments for RF Power products.
What you'll do
- Develop backend assembly processes and package developments for RF Power products, including process recipe development, equipment upgrades, and material selection. - Define specifications and guidelines for technology development projects while anticipating and resolving process, material, and equipment limitations. - Design new customized tooling to adapt off-the-shelf equipment for high-volume production. - Perform verification and qualification activities for new tooling, machinery, and materials. - Work with equipment vendors, subcontractors, and internal teams to qualify, bring up, and debug equipment. - Create, review, and update design and equipment process FMEA, while coordinating initial mechanical reliability testing and failure analysis for root cause finding.
What you'll need
- Currently pursuing a degree in Engineering, Materials Science, or a related technical discipline. - Knowledge of backend assembly processes or semiconductor packaging developments. - Understanding of process recipe development, equipment qualification, and material selection. - Familiarity with process FMEA (Failure Mode and Effects Analysis) and mechanical reliability testing.
Skills: Backend Assembly, Package Developments, process recipe, FMEA
This role has been open 0 days — well below the 57-day median for Packaging Engineering roles.
Packaging Engineering · Packaging
|
Open roles in category
220
|
Median days open
57 d
|
Median salary
$165k
|
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
| Metric | MACOM | All employers we track in this specialty (220 roles · 42 employers) |
|---|---|---|
| Open roles in this specialty | 8 | 220 |
| Open roles in the wider Process, Fab & Equipment family | 90 | 10278 · 109 employers |
| Median days open | 0 d | 57 d (−57 d vs this employer) |
| Median salary (USD postings) | — | $165k |
Skills observed across this category: Backend Assembly, Package Developments, process recipe, FMEA
Who's hiring in this category
- Renesas Electronics · 31 open roles · median 37 d
- Infineon Technologies · 25 open roles · median 36 d
- Micron Technology · 20 open roles · median 77 d
- onsemi · 16 open roles · median 33 d
- Skyworks · 12 open roles · median 10 d
- Intel Corporation · 11 open roles · median 112 d
How we counted: 220 open Packaging Engineering (Packaging) roles from 42 employers tracked in the SemiconductorJobs index, counted 28 Oct 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.