Electromagnetics (EM) and Packaging Design Engineer - Dallas, TX, United States
Originally posted 26 October 2026 by the employer.
Lead electromagnetic modeling and high-speed interconnect simulations for 2.5D/3D heterogeneously integrated systems using HFSS and EMX.
About the role
This role is responsible for RF modeling of new technology platforms and product developments within Kilby Labs, including Silicon Photonics, RF filters, and 2.5D/3D heterogeneously integrated systems. You will execute high frequency and high-speed interconnect simulations and lead electromagnetic modeling across advanced packages, TSVs, and module co-designs.
What you'll do
- Drive and execute high frequency and high-speed interconnect simulations for advanced packages, TSVs, and heterogeneously integrated 2.5D/3D systems. - Build and analyze electromagnetic models of RF passive structures, including filters, matching networks, baluns, couplers, RF transitions, and interconnects. - Perform electromagnetic simulations using tools such as HFSS and EMX. - Run circuit and system-level simulations using extracted S-parameters. - Investigate RF interactions across circuits, package structures, and passive components. - Draw mask layouts for test structures to support proof-of-concept studies and technology development activities while evaluating performance and manufacturability trade-offs.
What you'll need
- Master’s or Ph.D. degree in Electrical Engineering, Physics, Applied Physics, or Material Science. - 3+ years of industry experience in EM design. - Solid understanding of S-parameters and impedance matching. - Experience with semiconductor technologies such as CMOS, BiCMOS, GaAs, or InP, alongside knowledge of standard back-end-of-line (BEOL) stack-ups. - Familiarity with one or more software tools: Ansys HFSS, Keysight ADS, EMX, or Cadence Virtuoso. - Hands-on experience with layout drawing and RF measurements.
Nice to have
- Understanding of RF and microwave circuits, electromagnetic theory, and analog and RF integrated circuit design. - Knowledge of RF filter design. - Knowledge of microelectronic fabrication and advanced packaging technologies. - Knowledge of high-speed PCB design.
Skills: HFSS, EMX, S-parameters, advanced packaging, TSVs, 2.5D/3D
This role has been open 0 days — well below the 122-day median for Chiplet/Advanced Packaging Design roles.
Chiplet/Advanced Packaging Design · Chiplet Interconnect
|
Open roles in category
38
|
Median days open
122 d
|
Median salary
$219k
|
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
| Metric | Texas Instruments | All employers we track in this specialty (38 roles · 18 employers) |
|---|---|---|
| Open roles in this specialty | 1 | 38 |
| Median days open | 0 d | 122 d (−122 d vs this employer) |
| Median salary (USD postings) | — | $219k |
Skills observed across this category: HFSS, EMX, S-parameters, advanced packaging, TSVs, 2.5D/3D
Who's hiring in this category
- Marvell Technology · 5 open roles · median 54 d
- Qualcomm · 5 open roles · median 118 d
- Intel Corporation · 4 open roles · median 42 d
- Micron Technology · 4 open roles · median 165 d
- GlobalFoundries · 3 open roles · median 45 d
- NVIDIA · 3 open roles · median 80 d
How we counted: 38 open Chiplet/Advanced Packaging Design (Chiplet Interconnect) roles from 18 employers tracked in the SemiconductorJobs index, counted 26 Oct 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there. Figures refresh nightly.