ENGR STAFF, PACKAGE DEV : PKG & ASSY - Carmona, Cavite, Philippines
Originally posted 16 September 2026 by the employer.
About the role
This role is responsible for new package development from conceptualization to fully functional prototypes, and for technology transfer to development sites.
What you'll do
- Conduct tests and research on basic materials and properties involved in packaging.
- Develop solutions and provide recommendations on technical approach and project timing.
- Conduct design reviews and risk assessments.
- Manage technical risks of assigned projects to ensure mitigation actions are deployed.
- Generate and present POC and technology demonstration reports to stakeholders.
- Transfer technology to development sites.
What you'll need
- Bachelor's or Master's degree in Physics, Electrical Engineering, Chemical Engineering, Materials Science, Mechanical Engineering, or Electronics and Communications Engineering.
- 8 years of experience in semiconductor manufacturing, particularly in New Package/Product Development.
- Hands-on assembly development and manufacturing experience.
- Analytical skills in process, materials, and assembly equipment parameters.
- Hands-on experience in program management.
Skills: new package development, assembly development, manufacturing experience, process parameters, materials parameters
This role has been open 40 days — well below the 63-day median for Packaging Engineering roles.
Packaging Engineering · Advanced Packaging
|
Open roles in category
295
|
Median days open
63 d
|
Median salary
$167k
|
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
| Metric | onsemi | All employers we track in this specialty (295 roles · 59 employers) |
|---|---|---|
| Open roles in this specialty | 12 | 295 |
| Open roles in the wider Process, Fab & Equipment family | 254 | 10125 · 107 employers |
| Median days open | 41 d | 63 d (−22 d vs this employer) |
| Median salary (USD postings) | — | $167k |
Skills observed across this category: new package development, assembly development, manufacturing experience, process parameters, materials parameters
Who's hiring in this category
- KLA Corporation · 42 open roles · median 138 d
- Micron Technology · 39 open roles · median 45 d
- Intel Corporation · 20 open roles · median 30 d
- Renesas Electronics · 19 open roles · median 43 d
- GlobalFoundries · 14 open roles · median 70 d
- Lumilens · 13 open roles · median 81 d
How we counted: 295 open Packaging Engineering (Advanced Packaging) roles from 59 employers tracked in the SemiconductorJobs index, counted 27 Oct 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.
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