Technical Lead Package Platform Engineer - San Jose, California, United States
$160,000 - $200,000 USD yearly
Originally posted 22 August 2026 by the employer.
About the role
This role involves driving the development, qualification, and manufacturing of advanced FCBGA packages from concept through NPI, qualification, and high-volume manufacturing. This role includes contributing technical expertise to advanced packaging technologies, including Co-Packaged Optics (CPO) and Near-Packaged Optics (NPO).
What you'll do
- Lead FCBGA package NPI development from concept and die netlist through package design, assembly development, qualification, and production release.
- Provide technical leadership in FCBGA assembly manufacturing processes and laminate substrate technologies.
- Manage technical execution with substrate suppliers and assembly OSAT partners, covering schedule, quality, manufacturing readiness, yield improvement, and issue resolution.
- Lead package reliability assessment and qualification planning for FCBGA products, including large-body packages.
- Investigate and resolve customer returns and field quality issues related to package assembly processes, materials, and workmanship quality.
- Support package and substrate warpage characterization, analysis, and improvement, including material, package architecture, and assembly process impacts.
What you'll need
- Strong experience in FCBGA assembly manufacturing processes and laminate substrate technologies.
- Proven NPI development experience for advanced flip-chip packages, from early package definition through qualification and production release.
- Experience with package implementation from die netlist to flip-chip package design and manufacturing.
- Demonstrated experience managing substrate suppliers and assembly OSAT partners.
- Strong technical project management skills, including schedule and milestone management, technical risk assessment, issue resolution, and cross-functional execution.
- Experience managing and resolving customer returns and field quality issues related to semiconductor packaging, particularly package assembly processes, material quality, and supplier workmanship.
- Strong problem-solving skills with experience in root cause analysis, failure analysis, containment, corrective actions, and recurrence prevention.
Nice to have
- Experience with Cadence Allegro Package Designer (APD) or equivalent package design tools.
- Strong knowledge of FCBGA package reliability mechanisms, test methodologies, and qualification requirements.
- Experience developing and executing qualification plans for FCBGA packages.
- Experience with system-level reliability assessment of large-body FCBGA packages.
- Subject-matter expertise in Co-Packaged Optics (CPO) and/or Near-Packaged Optics (NPO).
- Deep technical expertise in package and substrate warpage, including characterization, modeling, material interactions, and assembly process impacts.
Skills: FCBGA packages, NPI development, assembly manufacturing processes, substrate suppliers, Co-Packaged Optics
This role has been open 37 days — well below the 58-day median for Packaging Engineering roles.
Packaging Engineering · Advanced Packaging
|
Open roles in category
297
|
Median days open
58 d
|
Median salary
$165k
|
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
| Metric | Astera Labs | All employers we track in this specialty (297 roles · 58 employers) |
|---|---|---|
| Open roles in this specialty | 4 | 297 |
| Open roles in the wider Process, Fab & Equipment family | 12 | 9494 · 108 employers |
| Median days open | 25 d | 58 d (−33 d vs this employer) |
| Median salary (USD postings) | — | $165k |
Skills observed across this category: FCBGA packages, NPI development, assembly manufacturing processes, substrate suppliers, Co-Packaged Optics
Who's hiring in this category
- KLA Corporation · 50 open roles · median 108 d
- Micron Technology · 33 open roles · median 32 d
- Infineon Technologies · 18 open roles · median 47 d
- Renesas Electronics · 18 open roles · median 23 d
- onsemi · 15 open roles · median 19 d
- Intel Corporation · 14 open roles · median 76 d
How we counted: 297 open Packaging Engineering (Advanced Packaging) roles from 58 employers tracked in the SemiconductorJobs index, counted 28 Sept 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.