Advanced Packaging Process Engineer - Arizona, Phoenix, United States

Originally posted 3 October 2026 by the employer.

This role is part of Intel's Advanced Packaging Technology Manufacturing (APTM) organization.

About the role

This role involves developing, optimizing, and qualifying advanced semiconductor packaging processes. This work directly enables Intel's products to reach billions of people around the world.

What you'll do

• Develop and optimize packaging assembly processes and equipment for high-volume manufacturing.
• Design and execute experiments using Statistical Process Control (SPC) and Design of Experiments (DOE).
• Innovate new techniques, materials, and tools for semiconductor packaging performance and reliability.
• Collaborate with cross-functional teams across engineering, manufacturing, and product development.
• Establish specifications for materials and equipment.
• Document and communicate technical findings, process improvements, and experimental results.
• Lead standardization efforts for manufacturing systems, equipment setups, and process flows.

What you'll need

• Master's degree with 3+ years of relevant experience, or PhD with 1+ years of experience in Mechanical Engineering, Physics, Chemistry, or a related STEM field.
• Relevant experience in process development and equipment qualification in a manufacturing setting.

Nice to have

• 3+ years of experience in data analysis and risk assessment methodologies.
• 3+ years of experience in Statistical Process Control (SPC), Design of Experiments (DOE), and process characterization techniques.
• 3+ years of experience in semiconductor fabrication processes, assembly methodologies, and packaging flows (e.g., flip chip, fan-out, 2.5D/3D integration).
• 3+ years of experience in programming languages such as Python, MATLAB, or SQL for complex data analysis.
• 3+ years of experience in quality systems, documentation standards, and packaging reliability evaluation tools.