TD Media and Collaterals Development Engineer - Arizona, Phoenix, United States
$85,200 - $139,810 USD yearly
Originally posted 6 July 2026 by the employer. Relisted by the employer on 25 September 2026.
About the role
As a Packaging Module Development Engineer in the Media Development organization, you will develop and optimize assembly media and collaterals to improve reliability, manufacturability, and cost efficiency.
What you'll do
- Develop and optimize media and collaterals to meet quality, reliability, cost, yield, and productivity targets. - Design and implement new media and collateral solutions, leveraging statistical methods like Design of Experiments (DOE) and Statistical Process Control (SPC). - Conduct evaluations of media and collaterals under simulated field conditions, including tests for heat, humidity, temperature cycling, and dynamic forces. - Lead initiatives to identify and mitigate media and collateral quality and reliability risks. - Provide technical consultation on media and collateral challenges and deliver solutions aligned with operational and technology milestones. - Document technical improvements and innovations through research papers and presentations.
What you'll need
- Bachelor's degree in mechanical engineering or a related field. - 6 months of hands-on experience in equipment engineering, mechanical design, and/or process engineering.
Nice to have
- Experience with mechanical design software such as SolidWorks or AutoCAD. - Portfolio showcasing self-completed projects from concept to fabrication. - Familiarity with semiconductor packaging processes and technology.
Skills: assembly processes, packaging platform technologies, manufacturing of packages, material specifications, packaging quality and reliability
This role has been open 107 days — well above the 57-day median for Packaging Engineering roles.
Packaging Engineering · Packaging
|
Open roles in category
212
|
Median days open
57 d
|
Median salary
$165k
|
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
| Metric | Intel Corporation | All employers we track in this specialty (212 roles · 43 employers) |
|---|---|---|
| Open roles in this specialty | 9 | 212 |
| Open roles in the wider Process, Fab & Equipment family | 186 | 10066 · 107 employers |
| Median days open | 107 d | 57 d (+50 d vs this employer) |
| Median salary (USD postings) | — | $165k |
Skills observed across this category: assembly processes, packaging platform technologies, manufacturing of packages, material specifications, packaging quality and reliability
Who's hiring in this category
- Infineon Technologies · 28 open roles · median 43 d
- Renesas Electronics · 27 open roles · median 36 d
- Micron Technology · 21 open roles · median 103 d
- onsemi · 15 open roles · median 26 d
- Monolithic Power Systems · 11 open roles · median 215 d
- Intel Corporation (this employer) · 9 open roles · median 106 d
How we counted: 212 open Packaging Engineering (Packaging) roles from 43 employers tracked in the SemiconductorJobs index, counted 21 Oct 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.