Principal Package Design Engineering - Plano, United States
Originally posted 21 October 2026 by the employer.
About the role
Design and develop package and interconnect methods for power SiP/modules, flip-chip LGA, multi-chip modules with substrate or embedded die/capacitor, and power device packaging. This role covers package technology qualification across consumer, industrial, and automotive power applications.
What you'll do
- Benchmark, select, and qualify materials, processes, and assembly subcontractors (OSAT) or contract manufacturers (CM). - Collaborate with OSATs and CMs to develop and execute DOEs to optimize processes and establish process specifications. - Partner with product groups and reliability teams to qualify new packages and processes within required timeframes. - Resolve process integration issues by verifying window checks on critical process steps and establishing production controls. - Oversee the transition into production, implement ramp-up monitoring, and resolve early production issues with OSATs/CMs. - Establish and maintain package design rules and participate in packaging roadmap development.
What you'll need
- Bachelor’s, Master’s, or Doctorate in Physics, Chemistry, Mechanical, Electrical, or Materials Engineering. - 10-15 years of relevant experience in package development emphasizing power SiP/module, wafer level, and flip-chip LGA packaging. - Deep understanding of power SiP/modules with substrates or embedded die/capacitors, along with assembly processes and qualification methods. - Hands-on experience with SPC and statistical analysis software.
Nice to have
- Knowledge of Cu FSM/BGBM technologies.
This role has been open 0 days — well below the 65-day median for Packaging Engineering roles.
Packaging Engineering · Advanced Packaging
|
Open roles in category
294
|
Median days open
65 d
|
Median salary
$167k
|
See the full market breakdown ▾Category comparison, and who else is hiring
| Metric | Renesas Electronics | All employers we track in this specialty (294 roles · 57 employers) |
|---|---|---|
| Open roles in this specialty | 20 | 294 |
| Open roles in the wider Process, Fab & Equipment family | 197 | 10066 · 107 employers |
| Median days open | 42 d | 65 d (−23 d vs this employer) |
| Median salary (USD postings) | — | $167k |
Who's hiring in this category
- KLA Corporation · 44 open roles · median 132 d
- Micron Technology · 39 open roles · median 39 d
- Intel Corporation · 17 open roles · median 64 d
- Renesas Electronics (this employer) · 15 open roles · median 51 d
- GlobalFoundries · 14 open roles · median 64 d
- Lumilens · 13 open roles · median 75 d
How we counted: 294 open Packaging Engineering (Advanced Packaging) roles from 57 employers tracked in the SemiconductorJobs index, counted 21 Oct 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.