Sr. Package Engineer, Annapurna Labs - AI Silicon Packaging - Austin, Texas, United States
Originally posted 20 October 2026 by the employer.
Join the Annapurna Labs team building packaging, substrate/PCB, and interposer technologies for Trainium AI accelerators.
About the role
The Package Technology Development team within Annapurna Labs develops packaging, substrate/PCB, interposer, and assembly technologies for Trainium AI accelerators. The role spans architecture, design, materials, processes, yield, warpage, reliability, and system-level integration from concept through volume production.
What you'll do
- Define and drive package technology development across architecture, design, materials, processes, yield, warpage, reliability, and system-level integration from early concept through volume production. - Partner with OSATs and component, material, and equipment suppliers on capability validation, test vehicle development, qualification, TGA, FMEA, risk retirement, root-cause analysis, and corrective/preventive actions. - Evaluate tradeoffs across performance, cost, yield, manufacturability, warpage, thermal performance, and reliability to guide technology decisions and qualification strategies. - Represent the package technology team in cross-functional design reviews, sign-off milestones, and program checkpoints with silicon, board, system, and supply chain teams. - Identify opportunities for novel packaging architectures and process simplifications to reduce cost and improve yield.
What you'll need
- Experience in package technology development across architecture, design, materials, processes, and system-level integration. - Experience collaborating with OSATs and materials or equipment suppliers on capability validation, test vehicle development, and qualification. - Practical knowledge of packaging failure analysis and risk mitigation methods including TGA, FMEA, and root-cause analysis. - Demonstrated background evaluating tradeoffs across warpage, thermal performance, manufacturability, reliability, and yield.
This role has been open 0 days — well below the 65-day median for Packaging Engineering roles.
Packaging Engineering · Advanced Packaging
|
Open roles in category
294
|
Median days open
65 d
|
Median salary
$167k
|
See the full market breakdown ▾Category comparison, and who else is hiring
| Metric | Amazon | All employers we track in this specialty (294 roles · 57 employers) |
|---|---|---|
| Open roles in this specialty | 2 | 294 |
| Open roles in the wider Process, Fab & Equipment family | 4 | 10066 · 107 employers |
| Median days open | 7 d | 65 d (−58 d vs this employer) |
| Median salary (USD postings) | — | $167k |
Who's hiring in this category
- KLA Corporation · 44 open roles · median 132 d
- Micron Technology · 39 open roles · median 39 d
- Intel Corporation · 17 open roles · median 64 d
- Renesas Electronics · 15 open roles · median 51 d
- GlobalFoundries · 14 open roles · median 64 d
- Lumilens · 13 open roles · median 75 d
How we counted: 294 open Packaging Engineering (Advanced Packaging) roles from 57 employers tracked in the SemiconductorJobs index, counted 21 Oct 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.