Substrate Process & Test Technology Development - TX, Austin, United States
Originally posted 27 October 2026 by the employer.
About the role
Lead the development, qualification, and manufacturing enablement of substrate technologies supporting AMD's advanced packaging roadmap. The role focuses on substrate process development, test vehicle strategy, yield optimization, process characterization, and identification of technology risks during development and manufacturing ramp.
What you'll do
- Lead development and qualification of package substrate technologies, driving process integration across imaging, lamination, via formation, metallization, plating, surface finish, and assembly interfaces. - Define substrate test vehicle strategies and characterization methodologies to evaluate technology capabilities, process margins, and manufacturability. - Drive yield learning, statistical process control, and root-cause analysis for substrate-related manufacturing excursions. - Develop qualification plans, technology risk assessments, and reliability assessment methodologies to resolve process-induced failure mechanisms. - Partner with substrate suppliers, OSATs, and material vendors to evaluate technology readiness, manufacturing capability, and defect density.
What you'll need
- Professional experience in substrate manufacturing processes, test methodologies, process integration, failure analysis, yield engineering, and technology qualification. - Demonstrated experience partnering with suppliers to optimize yield, reliability, and process capability across fabrication processes. - Experience with data-driven engineering approaches to address manufacturing challenges.
Nice to have
- Semiconductor packaging experience. - Hands-on experience with ABF (Ajinomoto Buildup Film) substrates, advanced HDI (high density interconnect) technologies, fine-line processes, and advanced via structures. - Strong background in yield engineering, defect reduction, statistical process control, and process characterization. - Experience developing test vehicles and qualification methodologies for substrate technologies. - Direct experience working with substrate suppliers and OSAT partners.
Skills: substrate, packaging, ABF, HDI, yield, process integration
This role has been open 0 days — well below the 63-day median for Packaging Engineering roles.
Packaging Engineering · Advanced Packaging
|
Open roles in category
295
|
Median days open
63 d
|
Median salary
$167k
|
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
| Metric | AMD | All employers we track in this specialty (295 roles · 59 employers) |
|---|---|---|
| Open roles in this specialty | 8 | 295 |
| Open roles in the wider Process, Fab & Equipment family | 50 | 10147 · 107 employers |
| Median days open | 48 d | 63 d (−15 d vs this employer) |
| Median salary (USD postings) | — | $167k |
Skills observed across this category: substrate, packaging, ABF, HDI, yield, process integration
Who's hiring in this category
- KLA Corporation · 42 open roles · median 138 d
- Micron Technology · 39 open roles · median 45 d
- Intel Corporation · 20 open roles · median 30 d
- Renesas Electronics · 19 open roles · median 43 d
- GlobalFoundries · 14 open roles · median 70 d
- Lumilens · 13 open roles · median 81 d
How we counted: 295 open Packaging Engineering (Advanced Packaging) roles from 59 employers tracked in the SemiconductorJobs index, counted 27 Oct 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.