Staff Thermal & Thermo-Mechanical Analysis Engineer - Contractor
Architect thermal solutions for AI data center hardware utilizing TSMC CoWoS-L with Silicon Interposers.
About the role
TYLsemi is seeking a Staff Thermal & Thermo-Mechanical Analysis Engineer to lead the simulation, modeling, and architectural definition of AI data center hardware. The role is responsible for the thermal integrity of high-power AI systems across advanced CoWoS architectures, complex substrate packaging, and high-layer-count data center PCBs.
What you'll do
- Build high-fidelity static and dynamic thermal models for AI workloads spanning silicon, advanced packaging, and system levels.
- Predict and mitigate structural risks including warpage, die-tilt, thermal stress, and solder joint reliability (BLR/BGA).
- Simulate transient thermal behavior under varying data center workloads, calculating time-dependent nodal temperatures and plotting thermal contours.
- Develop, propose, and implement cooling and mechanical mitigation techniques such as TIM selection, stiffener rings, and optimized copper balancing.
- Perform thermal modeling and CFD analysis for die, package, board, and system designs to develop cooling solutions for high-power AI/HPC devices exceeding 1kW TDP.
- Partner with Silicon Architecture, Package Design, and System Hardware teams while engaging with ODMs and cooling ecosystem partners.
What you'll need
- 5+ years of industry experience in thermal and structural analysis of semiconductor packages and systems.
- Proficiency in industry-standard thermal and thermo-mechanical simulation tools, specifically Ansys Icepak and Cadence Celsius (or Fluent, Star-CCM+, FLOEFD, RedHawk-SC ET).
- Proven experience modeling high-density packaging architectures, specifically TSMC CoWoS-L (with Silicon Interposers).
- Deep understanding of complex package substrates and heavy data center-class PCBs.
- Hands-on experience analyzing high-power GPU workloads (700W–1000W+) under both static steady-state and dynamic transient states.
- Ability to extract, analyze, and present complex simulation metrics, including multi-layer thermal contours and structural warpage profiles.
More semiconductor jobs: Hardware design jobs · San Jose jobs
This role has been open 18 days — well below the 46-day median for Hardware Systems Engineering roles.
Hardware Systems Engineering · AI ML Hardware
|
Open roles in category
1126
|
Median days open
46 d
|
Category median salary (all employers)
$150k
|
See the full market breakdown ▾Category comparison, and who else is hiring
| Metric | TYLsemi | All employers we track in this specialty (1126 roles · 109 employers) |
|---|---|---|
| Open roles in this specialty | 1 | 1126 |
| Open roles in the wider Software, Firmware & Systems family | 5 | 6531 · 156 employers |
| Median days open | 18 d | 46 d (−28 d vs this employer) |
| Median salary (USD postings) | — | $150k |
Who's hiring in this category
- Intel Corporation · 88 open roles · median 33 d
- KLA Corporation · 66 open roles · median 59 d
- Applied Materials · 60 open roles · median 40 d
- ASML · 59 open roles · median 17 d
- NVIDIA · 58 open roles · median 74 d
- Teradyne · 58 open roles · median 51 d
How we counted: 1126 open Hardware Systems Engineering (AI ML Hardware) roles from 109 employers tracked in the SemiconductorJobs index, counted 8 Nov 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Software, Firmware & Systems family row. Figures refresh nightly.