Staff Signal and Power Integrity Engineer - Chandler, Arizona, United States
$198,100 - $268,000 USD yearly
Originally posted 19 May 2026 by the employer.
About the role
This role focuses on System-in-Package development within the SIPI team to enhance Arm IP performance. You will build and analyze package designs while delivering silicon and platform electrical integrity solution spaces.
What you'll do
- Build and analyze System-in-Package designs. - Deliver build methodologies and silicon/platform electrical integrity solution spaces. - Develop power delivery techniques and interfaces. - Supervise package builds and run specific packaging analysis tools. - Serve as a technical lead and provide technical oversight to sub-workgroups.
What you'll need
- More than 5 years of experience in system-level signal integrity. - Expertise with SIPI analysis environments including Ansys suite and Cadence. - Deep understanding of multi-port matrices, including S, Y, and Z parameters. - Knowledge of electromagnetic extraction methodologies. - Ability to drive modifications in the build and give technical direction.
Skills: System-in-Package, Signal Integrity, SIPI analysis, electromagnetic extraction, advanced packaging
This role has been open 120 days — well above the 63-day median for Packaging Engineering roles.
Packaging Engineering · Advanced Packaging
|
Open roles in category
303
|
Median days open
63 d
|
Median salary
$167k
|
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
| Metric | Arm Holdings | All employers we track in this specialty (303 roles · 58 employers) |
|---|---|---|
| Open roles in this specialty | 2 | 303 |
| Open roles in the wider Process, Fab & Equipment family | 8 | 10119 · 106 employers |
| Median days open | 120 d | 63 d (+57 d vs this employer) |
| Median salary (USD postings) | — | $167k |
Skills observed across this category: System-in-Package, Signal Integrity, SIPI analysis, electromagnetic extraction, advanced packaging
Who's hiring in this category
- KLA Corporation · 44 open roles · median 133 d
- Micron Technology · 40 open roles · median 39 d
- Renesas Electronics · 20 open roles · median 43 d
- Intel Corporation · 19 open roles · median 28 d
- GlobalFoundries · 14 open roles · median 65 d
- Lumilens · 13 open roles · median 76 d
How we counted: 303 open Packaging Engineering (Advanced Packaging) roles from 58 employers tracked in the SemiconductorJobs index, counted 22 Oct 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.