Package Engineer, Annapurna Labs - AI Silicon Packaging - Austin, Texas, United States
Originally posted 22 October 2026 by the employer.
Develop packaging, substrate, interposer, and assembly technologies for Trainium AI accelerators at Annapurna Labs.
About the role
The Package Technology Development team within Annapurna Labs develops packaging, substrate/PCB, interposer, and assembly technologies for Trainium AI accelerators.
What you'll do
- Define and drive package technology development across architecture, design, materials, processes, yield, warpage, reliability, and system-level integration from early concept through volume production. - Partner with OSATs and component, material, and equipment suppliers on capability validation, test vehicle development, qualification, TGA, FMEA, risk retirement, root-cause analysis, and corrective or preventive actions. - Evaluate tradeoffs across performance, cost, yield, manufacturability, warpage, thermal performance, and reliability to guide technology decisions and qualification strategies. - Represent the package technology team in cross-functional design reviews, sign-off milestones, and program checkpoints with silicon, board, system, and supply chain teams. - Identify opportunities for packaging architectures and process simplifications to reduce cost, improve yield, and lower time-to-market.
What you'll need
- Experience in semiconductor packaging technology development covering substrate/PCB, interposer, or assembly processes. - Experience collaborating with OSATs and material or equipment suppliers on capability validation and qualification. - Working knowledge of packaging reliability, warpage evaluation, TGA, and FMEA methodology. - Ability to analyze tradeoffs across thermal performance, electrical performance, cost, manufacturability, and yield.
This role has been open 0 days — well below the 63-day median for Packaging Engineering roles.
Packaging Engineering · Advanced Packaging
|
Open roles in category
303
|
Median days open
63 d
|
Median salary
$167k
|
See the full market breakdown ▾Category comparison, and who else is hiring
| Metric | Amazon | All employers we track in this specialty (303 roles · 58 employers) |
|---|---|---|
| Open roles in this specialty | 3 | 303 |
| Open roles in the wider Process, Fab & Equipment family | 5 | 10119 · 106 employers |
| Median days open | 1 d | 63 d (−62 d vs this employer) |
| Median salary (USD postings) | — | $167k |
Who's hiring in this category
- KLA Corporation · 44 open roles · median 133 d
- Micron Technology · 40 open roles · median 39 d
- Renesas Electronics · 20 open roles · median 43 d
- Intel Corporation · 19 open roles · median 28 d
- GlobalFoundries · 14 open roles · median 65 d
- Lumilens · 13 open roles · median 76 d
How we counted: 303 open Packaging Engineering (Advanced Packaging) roles from 58 employers tracked in the SemiconductorJobs index, counted 22 Oct 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.