Product & Program Management
Originally posted 6 October 2026 by the employer.
About the role
This role involves leading project teams across multiple global sites to drive the setup of new front-end wafer process technology. You will be the overall project owner and the single point of contact for internal teams.
What you'll do
- Plan, maintain, and execute new technology introduction projects.
- Lead project members and stakeholders to achieve key milestones and customer commitments.
- Manage and drive actions for external partners, including foundries and vendors.
- Identify major project risks and formulate/implement mitigation measures.
- Report progress to key internal and external stakeholders.
What you'll need
- Bachelor's or Master's degree in Electrical Engineering, Materials Science, or a related technical field.
- Project management certification such as PMP, PRINCE2, or equivalent practical experience.
- At least 5 years of experience in the semiconductor industry.
- Strong interpersonal skills and leadership to influence others without direct authority.
- High communication skills (reading, writing, and conversation) in English, Japanese, and Chinese.
Nice to have
- Process integration engineer experience in semiconductor high-volume manufacturing (HVM) or research and development (R&D) environments.
- Practical experience in process development, technology transfer, and yield ramp.
- Basic knowledge of unit processes including lithography, etching, cleaning, and CMP.
- Knowledge of GaN (gallium nitride) technology and its process flow/related tools.
Skills: project management, front-end wafer process, technology transfer, yield ramp, foundry