Product & Program Management
Originally posted 29 September 2026 by the employer.
About the role
This role involves project management to enable new front-end process technologies at external/internal foundries. The technologies include HV/BCD and wide bandgap for power applications, as well as Mixed-Signal and RF processes.
What you'll do
- Lead multi-site project teams for front-end wafer process technology enablement.
- Take full project ownership and act as the primary contact for internal teams.
- Develop, maintain, and execute project plans for new technology enablement.
- Drive project members and contributors to meet critical milestones and customer commitments.
- Track and drive actions for external partners and suppliers, including foundries and other vendors.
- Identify key program risks, define, and implement mitigation actions.
- Track and report progress to key stakeholders.
What you'll need
- Bachelor's or Master's degree in electrical engineering, materials science, or a related technical field.
- Prior experience or training (e.g., PMP, Prince2) in project management.
- 5+ years of experience in the semiconductor industry, preferably in a foundry/fab.
- Strong interpersonal skills.
- Good written and verbal communication skills; fluency in English, Japanese, and Mandarin.
Skills: project ownership, foundry process technology, front-end wafer process, process integration, technology transfer, yield ramp