Staff Process Engineer - Batu Berendam, my, Malaysia
Originally posted 24 September 2026 by the employer.
This role focuses on Power QFN package and Cu Clip related thin die assembly processes.
About the role
This role involves qualifying, sustaining, and improving processes for Power QFN packages and Cu Clip related thin die assembly. You will focus on the design and development of PQFN packages for Smart Power Stage (SPS) products and their associated modules.
What you'll do
- Design and develop processes to qualify PQFN packages for SPS products and modules.
- Ramp up manufacturing volume and qualify required sources.
- Sustain production lines and improve assembly yield, capacity, quality, and costs.
- Address internal and external customer feedback by collaborating with Test/Product Engineers, Quality, and Operations.
- Manage Product Lifecycle Management documents to maintain current status.
- Conduct change-management with suppliers to sustain and improve capacity and cost.
- Serve as the key manufacturing engineering interface for NPI-to-production transfers.
- Manage OSAT and contract manufacturing relationships supporting production.
What you'll need
- Degree in Mechanical, Material, Physics, Chemistry, or Applied Sciences.
- Experience in process engineering or package development of material/process/design of thin wafer handling and SPS solder attach processes.
- Knowledge in quality/reliability requirements of PQFNs/QFNs/WLCSP and leaded packages.
- Knowledge of wire bonding.
- Knowledge of SPC and statistical analysis software (such as JMP).
- Strong analytical, written communication, and presentation skills.
Nice to have
- Experience with Cu Clip, Thin Die, Power QFN.
- Package development knowledge.
- Experience transitioning products from Development to Production.
- Experience supporting NPI to Mass Production.
This role has been open 0 days — well below the 70-day median for Packaging Engineering roles.
Packaging Engineering · Packaging
|
Open roles in category
198
|
Median days open
70 d
|
Median salary
$167k
|
See the full market breakdown ▾Category comparison, and who else is hiring
| Metric | Renesas Electronics | All employers we track in this specialty (198 roles · 42 employers) |
|---|---|---|
| Open roles in this specialty | 21 | 198 |
| Open roles in the wider Process, Fab & Equipment family | 175 | 9525 · 109 employers |
| Median days open | 27 d | 70 d (−43 d vs this employer) |
| Median salary (USD postings) | — | $167k |
Who's hiring in this category
- Infineon Technologies · 29 open roles · median 35 d
- Renesas Electronics (this employer) · 20 open roles · median 27 d
- Micron Technology · 18 open roles · median 146 d
- Monolithic Power Systems · 12 open roles · median 188 d
- Intel Corporation · 11 open roles · median 153 d
- onsemi · 8 open roles · median 51 d
How we counted: 198 open Packaging Engineering (Packaging) roles from 42 employers tracked in the SemiconductorJobs index, counted 24 Sept 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.