Staff Packaging Engineer - Irvine, CA, United States
Packaging & Advanced Integration
Join Skyworks' Advanced IC Packaging team to develop advanced semiconductor packaging technologies for wireless products.
About the role
This role involves developing advanced semiconductor packaging technologies for wireless products. You will lead thermal and mechanical simulation efforts and influence package design decisions.
What you'll do
- Develop thermo-mechanical finite element models (FEM) of IC packages to evaluate stress, strain, and deformation.
- Set up moldflow simulation models to predict molding process risks.
- Create, maintain, and document simulation methodologies, modeling procedures, automation scripts, and analysis workflows.
- Collaborate with material suppliers and characterization teams to obtain and validate material properties.
- Support Package & PCB design, Component Integration and New Technology Introduction (NTI) activities with simulation-driven insights.
What you'll need
- BS with 8+ years, MS with 6+ years, or PhD with 3+ years of experience in Mechanical Engineering or related field.
- Strong fundamentals in solid mechanics, heat transfer, materials science, and reliability engineering.
- Hands-on experience with finite element analysis (FEA) tools such as ANSYS (APDL and Workbench), Icepak, ABAQUS, FloTHERM, COMSOL, or equivalent simulation platforms.
- Proven experience in IC package modeling and simulation, including stress, strain, warpage, thermal performance, and reliability assessments.
- Experience modeling package assembly processes such as die attach, wire bonding, molding, curing, and board-level assembly, and reliability test conditions (thermal cycling, drop/shock, mechanical bending).
- Familiarity with advanced packaging technologies and manufacturing processes, including SiP, MCM, WLCSP, flip-chip, and dual-sided package architectures.
Nice to have
- Experience with advanced semiconductor packaging technologies such as flip-chip, fan-out, 2.5D/3D packaging, heterogeneous integration, chiplets, and wafer-level packaging.
- Experience modeling package-to-board interactions, PCB warpage, solder joint reliability, and board-level reliability.
- Knowledge of packaging materials, material characterization techniques, and constitutive material modeling, including viscoelastic and temperature-dependent material behavior.
- Experience developing automated simulation workflows using scripting languages such as Python, APDL, MATLAB, or similar tools.
- Familiarity with Design of Experiments (DOE), statistical analysis, and model calibration techniques.
- Experience supporting high-volume manufacturing and driving yield, reliability, or cost improvements through simulation.
- Experience in RF, BAW/SAW, power management, or other mobile semiconductor packaging technologies.
- Ability to develop new modeling methodologies and build simulation capabilities for emerging package technologies.
Market context
This role has been open 11 days — well below the 55-day median for Packaging Engineering roles.
Packaging Engineering · Advanced Packaging
|
Open roles in category
299
|
Median days open
55 d
|
Median salary
$179k
|
See the full market breakdown ▾Category comparison, and who else is hiring
| Metric | Skyworks | All employers we track in this specialty (299 roles · 58 employers) |
|---|---|---|
| Open roles in this specialty | 7 | 299 |
| Open roles in the wider Process, Fab & Equipment family | 106 | 9346 · 108 employers |
| Median days open | 11 d | 55 d (−44 d vs this employer) |
| Median salary (USD postings) | — | $179k |
Who's hiring in this category
- KLA Corporation · 49 open roles · median 102 d
- Micron Technology · 36 open roles · median 29 d
- Renesas Electronics · 21 open roles · median 21 d
- Infineon Technologies · 20 open roles · median 41 d
- Intel Corporation · 13 open roles · median 76 d
- Lumilens · 13 open roles · median 45 d
How we counted: 299 open Packaging Engineering (Advanced Packaging) roles from 58 employers tracked in the SemiconductorJobs index, counted 21 Sept 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.