Staff Packaging Design Engineer封装开发工程师 （功率模块） - Suzhou, China
Originally posted 9 September 2026 by the employer — open 12 days.
About the role
This role involves the design and development of Power Modules using embedded die laminate technology with SMT of Cap and Inductor for commercial industrial power device packaging.
What you'll do
- Design and develop Power Modules using embedded die laminate technology.
- Define package technologies tooling and qualification for commercial industrial power device packaging.
- Benchmark, select, and qualify materials, processes, and assembly subcontractors (OSAT).
- Develop detailed Power Module package drawings using AutoCAD.
- Work with OSAT to optimize processes and establish process specifications using DOE.
- Qualify new packages and processes with Product groups and Reliability team.
What you'll need
- Doctorate, Master's, or Bachelor's degree in Physics, Chemistry, Mechanical, Electrical, or Materials Engineering.
- 5-12 years of experience in package development emphasizing Power Module plastic package.
- Understanding of semiconductor Power Module plastic IC assembly processes, materials, and technology.
- Knowledge of AutoCAD, Excel, PowerPoint, Word.
- Knowledge of wire-bonding, flip chip, SMT, SPC (Statistical Process Control), and statistical analysis.
Skills: Power Modules, embedded die laminate, package technologies, OSAT, SPC
This role has been open 12 days — well below the 55-day median for Packaging Engineering roles.
Packaging Engineering · Advanced Packaging
|
Open roles in category
299
|
Median days open
55 d
|
Median salary
$179k
|
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
| Metric | Renesas Electronics | All employers we track in this specialty (299 roles · 58 employers) |
|---|---|---|
| Open roles in this specialty | 19 | 299 |
| Open roles in the wider Process, Fab & Equipment family | 173 | 9346 · 108 employers |
| Median days open | 21 d | 55 d (−34 d vs this employer) |
| Median salary (USD postings) | — | $179k |
Skills observed across this category: Power Modules, embedded die laminate, package technologies, OSAT, SPC
Who's hiring in this category
- KLA Corporation · 49 open roles · median 102 d
- Micron Technology · 36 open roles · median 29 d
- Renesas Electronics (this employer) · 21 open roles · median 21 d
- Infineon Technologies · 20 open roles · median 41 d
- Intel Corporation · 13 open roles · median 76 d
- Lumilens · 13 open roles · median 45 d
How we counted: 299 open Packaging Engineering (Advanced Packaging) roles from 58 employers tracked in the SemiconductorJobs index, counted 21 Sept 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.