Staff Package Development Engineer - Austin, United States
Originally posted 30 July 2026 by the employer.
About the role
This role is responsible for developing, qualifying, and industrializing semiconductor package solutions that meet product performance, reliability, manufacturability, cost, and schedule requirements.
What you'll do
- Develop, qualify, and industrialize semiconductor package solutions.
- Work closely with cross-functional teams and OSAT partners to bring new package technologies from concept through high-volume manufacturing.
- Drive complex technology development activities in a global environment.
- Conduct package reliability testing, failure analysis, and root-cause investigations.
- Collaborate with OSAT partners on package development and qualification.
What you'll need
- Bachelor's degree in Packaging Engineering, Mechanical Engineering, Materials Science, Chemical Engineering, Physics, Electrical Engineering, or a related technical discipline.
- Minimum 5+ years of experience in semiconductor package development, package integration, or advanced packaging technologies.
- Strong knowledge of semiconductor assembly processes, including Wafer backgrind, Wafer dicing, Die attach, Flip-chip assembly, Wire bonding, Underfill, Encapsulation and molding, Ball attach, Package singulation, and Surface-mount technology (SMT).
- Experience developing and qualifying semiconductor packages in collaboration with OSAT partners.
- Knowledge of Design of Experiments (DOE), statistical analysis, and structured problem-solving methodologies.
- Experience conducting package reliability testing, failure analysis, and root-cause investigations.
Nice to have
- Master's degree or Ph.D. in Packaging Engineering, Mechanical Engineering, Materials Science, Physics, Chemistry, or a related field.
- Experience with advanced packaging technologies such as Flip-Chip CSP (FCCSP), System-in-Package (SiP), Fan-Out Packaging (FOPLP/FOWLP), Wafer-Level Packaging (WLP/WLCSP), and 2.5D/3D Packaging.
- Knowledge of package thermal, mechanical, and electrical characterization techniques.
- Experience supporting automotive-grade product qualification and reliability standards.
- Knowledge of sustainability initiatives, packaging materials selection, and cost optimization techniques.
This role has been open 80 days — well above the 62-day median for Packaging Engineering roles.
Packaging Engineering · Advanced Packaging
|
Open roles in category
299
|
Median days open
62 d
|
Median salary
$167k
|
See the full market breakdown ▾Category comparison, and who else is hiring
| Metric | Renesas Electronics | All employers we track in this specialty (299 roles · 59 employers) |
|---|---|---|
| Open roles in this specialty | 17 | 299 |
| Open roles in the wider Process, Fab & Equipment family | 191 | 9897 · 109 employers |
| Median days open | 48 d | 62 d (−14 d vs this employer) |
| Median salary (USD postings) | — | $167k |
Who's hiring in this category
- KLA Corporation · 43 open roles · median 129 d
- Micron Technology · 38 open roles · median 38 d
- Renesas Electronics (this employer) · 17 open roles · median 48 d
- Intel Corporation · 16 open roles · median 42 d
- GlobalFoundries · 14 open roles · median 61 d
- Infineon Technologies · 14 open roles · median 67 d
How we counted: 299 open Packaging Engineering (Advanced Packaging) roles from 59 employers tracked in the SemiconductorJobs index, counted 18 Oct 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.