Sr. Director, Package Development Engineering - Santa Clara, CA, United States
$238,950 - $341,710 USD yearly
Originally posted 14 August 2026 by the employer.
Drive SiTime's innovative packaging roadmap leveraging conventional and advanced wafer scale packaging technologies.
About the role
This role drives SiTime's packaging technology, defining and executing the packaging roadmap that creates technical capabilities for product performance, form-factor, reliability, and cost. It focuses on creating thermally and mechanically stable environments for co-packaged MEMs using conventional and advanced wafer scale packaging technologies.
What you'll do
- Define the packaging roadmap and target assembly flows aligned to quality and reliability specifications.
- Lead technical relationships with OSAT partners to align and implement the packaging roadmap.
- Oversee design, analysis, and characterization for fit, thermal performance, structural stability, die stress, vibration immunity, and manufacturability.
- Collaborate with IC design teams to optimize parasitic capacitance, resistance, and signal integrity.
- Drive selection and qualification of substrates, die-attach materials, underfills, and mold compounds.
What you'll need
- Ph.D. or Master's degree in Mechanical Engineering, Materials Science, Microelectronics, or Physics.
- 10+ years of experience in semiconductor packaging R&D.
- 5+ years leading teams focused on advanced heterogeneous integration.
- Expertise in semiconductor materials, process integration, process engineering, and metrology.
- Demonstrated expertise in collaborating with OSATs and semiconductor foundries.
- Experience in managing high-performance, geographically distributed teams.
Skills: packaging roadmap, wafer scale packaging, OSAT development, heterogeneous integration, mechanical design
This role has been open 64 days — slightly above the 61-day median for Packaging Engineering roles.
Packaging Engineering · Advanced Packaging
|
Open roles in category
299
|
Median days open
61 d
|
Median salary
$167k
|
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
| Metric | SiTime | All employers we track in this specialty (299 roles · 59 employers) |
|---|---|---|
| Open roles in this specialty | 4 | 299 |
| Open roles in the wider Process, Fab & Equipment family | 18 | 9862 · 109 employers |
| Median days open | 43 d | 61 d (−18 d vs this employer) |
| Median salary (USD postings) | — | $167k |
Skills observed across this category: packaging roadmap, wafer scale packaging, OSAT development, heterogeneous integration, mechanical design
Who's hiring in this category
- KLA Corporation · 43 open roles · median 128 d
- Micron Technology · 38 open roles · median 37 d
- Renesas Electronics · 17 open roles · median 47 d
- Intel Corporation · 16 open roles · median 41 d
- GlobalFoundries · 14 open roles · median 60 d
- Infineon Technologies · 14 open roles · median 66 d
How we counted: 299 open Packaging Engineering (Advanced Packaging) roles from 59 employers tracked in the SemiconductorJobs index, counted 17 Oct 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.