$108,700 - $226,800 USD yearly
About the role
Responsible for the design and development of RF/Microwave module and packaged products, integrating single or multi-chip modules with GaN, GaAs, or Silicon-based MMICs into packaging technologies.
What you'll do
- Act as an individual contributor for RF/mm-wave single or multi-chip module (MCM) based product development.
- Integrate MMIC dies into air cavity or over-molded modules.
- Perform advanced package design using 2.5D and 3D electromagnetic simulators.
- Conduct product checkout, optimization, and design verification testing (DVT) in the test lab.
- Execute DVT analysis and present results to internal and external customers.
- Support products across lifecycle stages including concept/feasibility, development, qualification, and production.
What you'll need
- BS in Electrical Engineering with 8+ years of experience, MS with 5+ years, or PhD (with RF/Microwave focus) with 3+ years of relevant experience.
- Experience integrating microwave/millimeter-wave MMIC dies (amplifiers, switches, phase shifters, attenuators) in single or multichip air-cavity or over-mold transmit/receive front-end modules (FEMs).
- Expert-level user capability in 3D EM simulation tools such as HFSS and/or Analyst, plus familiarity with ADS, Microwave Office (MWO), or Cadence Spectre circuit simulators.
- Demonstrated experience analyzing performance tradeoffs of FEMs across package types including AC/OVM QFN, laminates, FCBGA, and LGA.
- Solid background in electromagnetic theory and RF fundamentals including s-parameters, impedance matching, transmission lines, and passive structures design.
- Hands-on experience in microwave measurements, characterization, and calibration methods, with knowledge of GaN, GaAs, and Silicon technologies.
- US Person status (US citizen, permanent resident, asylee, or refugee) to support US Government contracts.
Nice to have
- Knowledge of RF signal chain and system analysis.
- Knowledge of antenna design.
- Published author in technical journals and/or magazines.
More semiconductor jobs: Hardware design jobs
This role has been open 12 days — well below the 46-day median for Hardware Systems Engineering roles.
Hardware Systems Engineering · AI ML Hardware
|
Open roles in category
1126
|
Median days open
46 d
|
Category median salary (all employers)
$150k
|
See the full market breakdown ▾Category comparison, and who else is hiring
| Metric | Skyworks | All employers we track in this specialty (1126 roles · 109 employers) |
|---|---|---|
| Open roles in this specialty | 14 | 1126 |
| Open roles in the wider Software, Firmware & Systems family | 57 | 6531 · 156 employers |
| Median days open | 74 d | 46 d (+28 d vs this employer) |
| Median salary (USD postings) | — | $150k |
Who's hiring in this category
- Intel Corporation · 88 open roles · median 33 d
- KLA Corporation · 66 open roles · median 59 d
- Applied Materials · 60 open roles · median 40 d
- ASML · 59 open roles · median 17 d
- NVIDIA · 58 open roles · median 74 d
- Teradyne · 58 open roles · median 51 d
How we counted: 1126 open Hardware Systems Engineering (AI ML Hardware) roles from 109 employers tracked in the SemiconductorJobs index, counted 8 Nov 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Software, Firmware & Systems family row. Figures refresh nightly.