Staff Engineer, Semi Packaging Engineering - CA, San Jose, Rio Robles, United States
Originally posted 26 October 2026 by the employer.
About the role
This role leads the development and production implementation of advanced packaging solutions for module products from concept through qualification and production release.
What you'll do
- Develop packaging solutions, materials, assembly processes, and process control plans for new module products with material suppliers and assembly vendors during NPI. - Partner with product design teams to define package requirements, design rules, and module assembly specifications. - Work closely with overseas assembly subcontractors (OSATs) for new package development and engineering activities. - Conduct process failure mode and effects analysis (FMEA), execute design of experiments (DOE), and manage process change notifications (PCN). - Create and maintain package models, drawings, and design documentation. - Perform package-level and system-level thermal and mechanical simulation for design optimization and customer support.
What you'll need
- Master’s degree in Materials Science and Engineering, Applied Physics, Electrical Engineering, Mechanical Engineering, or a related field, plus at least 5 years of relevant industry experience. - Experience with surface-mount technology processes, package substrates, printed circuit board technologies, System-in-Package integration, wire-bond and flip-chip interconnects, passive-component integration, and flip-chip bumping. - Knowledge of package technologies, process flows, materials, chip-package interaction, IC package reliability standards, and failure analysis techniques. - Experience selecting IC package bill of materials (BOM) based on mechanical, thermal, and electrical properties of semiconductors, metals, ceramics, and polymer composites. - Working experience with manufacturing control plans, process failure mode and effects analysis (FMEA), process change notification (PCN), statistical process control (SPC), and design of experiments (DOE). - Proficiency with package-level and system-level thermal and mechanical simulation using FloTHERM, ANSYS Icepak, ANSYS Mechanical, or comparable tools.
This role has been open 0 days — well below the 62-day median for Packaging Engineering roles.
Packaging Engineering · Advanced Packaging
|
Open roles in category
299
|
Median days open
62 d
|
Median salary
$167k
|
See the full market breakdown ▾Category comparison, and who else is hiring
| Metric | Analog Devices | All employers we track in this specialty (299 roles · 59 employers) |
|---|---|---|
| Open roles in this specialty | 3 | 299 |
| Open roles in the wider Process, Fab & Equipment family | 165 | 10096 · 107 employers |
| Median days open | 83 d | 62 d (+21 d vs this employer) |
| Median salary (USD postings) | — | $167k |
Who's hiring in this category
- KLA Corporation · 42 open roles · median 137 d
- Micron Technology · 40 open roles · median 43 d
- Renesas Electronics · 21 open roles · median 47 d
- Intel Corporation · 20 open roles · median 29 d
- GlobalFoundries · 14 open roles · median 69 d
- Lumilens · 13 open roles · median 80 d
How we counted: 299 open Packaging Engineering (Advanced Packaging) roles from 59 employers tracked in the SemiconductorJobs index, counted 26 Oct 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.