Staff Engineer R&D - Wuxi, 无锡, China
Originally posted 20 September 2026 by the employer — open 0 days.
Join our team specializing in semiconductor power module packaging.
About the role
This Staff Engineer R&D position focuses on materials and components for semiconductor power module packaging. This role concentrates on critical materials and components such as baseplates, ceramic substrates, electrical connectors, PCBs, and plastic housings.
What you'll do
- Take material responsibility for materials and components for power module production.
- Participate in power module customization and cost optimization projects.
- Perform or assign material characterization and derive new test methods and material specifications.
- Collaborate with cross-site, international teams across China, Germany, and Hungary.
- Solve challenges related to materials and components as well as power module production.
- Support supplier management by defining specifications and assessing new suppliers.
What you'll need
- University degree in material sciences, mechanical engineering, or physics.
- Strong background in experimental material characterization.
- Profound experience with at least one of the main materials of power modules and their production processes (baseplates, ceramic substrates, electrical connectors, PCBs, and/or plastic housings).
- 1-3 years of professional experience in material or mechanical engineering, preferably power module engineering.
- Willingness to travel.
- Excellent communication skills in Chinese and English.
Skills: power module production, material characterization, material specifications, supplier management, back-end processing
This role has been open 0 days — well below the 54-day median for Packaging Engineering roles.
Packaging Engineering · Advanced Packaging
|
Open roles in category
299
|
Median days open
54 d
|
Median salary
$179k
|
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
| Metric | Infineon Technologies | All employers we track in this specialty (299 roles · 58 employers) |
|---|---|---|
| Open roles in this specialty | 20 | 299 |
| Open roles in the wider Process, Fab & Equipment family | 317 | 9314 · 108 employers |
| Median days open | 40 d | 54 d (−14 d vs this employer) |
| Median salary (USD postings) | — | $179k |
Skills observed across this category: power module production, material characterization, material specifications, supplier management, back-end processing
Who's hiring in this category
- KLA Corporation · 49 open roles · median 101 d
- Micron Technology · 36 open roles · median 28 d
- Renesas Electronics · 21 open roles · median 20 d
- Infineon Technologies (this employer) · 18 open roles · median 40 d
- Intel Corporation · 13 open roles · median 75 d
- Lumilens · 13 open roles · median 44 d
How we counted: 299 open Packaging Engineering (Advanced Packaging) roles from 58 employers tracked in the SemiconductorJobs index, counted 20 Sept 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.