Staff Engineer Process Development - Ipoh, Malaysia
Originally posted 30 September 2026 by the employer.
About the role
This role involves process development activities for semiconductor packaging, focusing on AOI and CDWJ processes.
What you'll do
- Perform AOI and CDWJ process development, including parameter optimization, verification, and freeze.
- Create or update DFMEA, PFMEA, and process specifications for AOI and CDWJ processes.
- Support engineering and qualification builds according to project timelines.
- Collaborate with material and equipment suppliers for continuous process improvement.
- Participate in Design Rules, Design of Manufacturing (DFM), Gap Analysis, and problem solving.
- Generate new ideas or new packaging technology related to AOI and CDWJ.
- Responsible for technical handshake and knowledge transfer from development to operation.
What you'll need
- At least 5 years of experience in process development within semiconductor packaging.
- Degree or Master's in Mechanical or Materials Engineering.
- Good process/equipment knowledge in semiconductor packaging, specifically AOI/CDWJ for Power packaging.
- Statistical analysis skills, including JMP.
Skills: process development, semiconductor packaging, AOI, CDWJ, DFM
This role has been open 0 days — well below the 74-day median for Packaging Engineering roles.
Packaging Engineering · Packaging
|
Open roles in category
202
|
Median days open
74 d
|
Median salary
$165k
|
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
| Metric | Wolfspeed | All employers we track in this specialty (202 roles · 42 employers) |
|---|---|---|
| Open roles in this specialty | 2 | 202 |
| Open roles in the wider Process, Fab & Equipment family | 76 | 9575 · 108 employers |
| Median days open | 0 d | 74 d (−74 d vs this employer) |
| Median salary (USD postings) | — | $165k |
Skills observed across this category: process development, semiconductor packaging, AOI, CDWJ, DFM
Who's hiring in this category
- Infineon Technologies · 27 open roles · median 41 d
- Renesas Electronics · 23 open roles · median 33 d
- Micron Technology · 17 open roles · median 147 d
- Intel Corporation · 12 open roles · median 158 d
- Monolithic Power Systems · 12 open roles · median 194 d
- onsemi · 12 open roles · median 17 d
How we counted: 202 open Packaging Engineering (Packaging) roles from 42 employers tracked in the SemiconductorJobs index, counted 30 Sept 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.