Staff Engineer, Packaging Engineering, Structural Simulation - Batu Kawan, my, Malaysia
Originally posted 14 September 2026 by the employer — open 5 days.
About the role
This role involves the modeling and simulation, design of experiment, and testing across semiconductor packaging, flash memory product, and host levels, with a focus on influencing package and product design by addressing structural integrity and reliability issues.
What you'll do
- Perform modeling and simulation, design of experiment, and testing of mechanical responses for IC package and flash products, including solid state drives.
- Influence package and product design by addressing structural integrity and reliability issues.
- Advance semiconductor packaging technology by addressing mechanical aspects and material/process interactions.
- Develop in-house structural simulation automation platforms based on commercial software such as ANSYS and Abaqus.
- Conduct relevant simulations for feasibility and validation of concepts and provide design solutions to support new package technology development.
What you'll need
- Ph.D. in Mechanical Engineering with >3 years of experience, or M.S. in Mechanical Engineering with >5 years of experience.
- Solid knowledge of mechanical engineering of IC packaging and related areas.
- Strong background in computational solid mechanics and/or experimental solid mechanics with emphasis on failure analysis and design of experiment.
- Broad knowledge of mechanical behaviors of composite laminates, polymers, and metals (e.g., solder).
- Working knowledge in designing and conducting mechanical testing and/or using a commercial FEA package.
- Good understanding of general semiconductor packaging processes, materials, technology and trends, such as substrate design and manufacturing, molding, wire-bonding, die attach, and flip chip.
Nice to have
- Knowledge of machine learning and data analytics utilizing AI.
- Experience with industry standards and regulations in semiconductor packaging.
Skills: semiconductor packaging, modeling and simulation, structural integrity, reliability issues, computational solid mechanics
This role has been open 5 days — well below the 65-day median for Packaging Engineering roles.
Packaging Engineering · Packaging
|
Open roles in category
199
|
Median days open
65 d
|
Median salary
$166k
|
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
| Metric | SanDisk | All employers we track in this specialty (199 roles · 41 employers) |
|---|---|---|
| Open roles in this specialty | 6 | 199 |
| Open roles in the wider Process, Fab & Equipment family | 74 | 9328 · 108 employers |
| Median days open | 49 d | 65 d (−16 d vs this employer) |
| Median salary (USD postings) | — | $166k |
Skills observed across this category: semiconductor packaging, modeling and simulation, structural integrity, reliability issues, computational solid mechanics
Who's hiring in this category
- Infineon Technologies · 28 open roles · median 30 d
- Micron Technology · 19 open roles · median 141 d
- Renesas Electronics · 19 open roles · median 23 d
- Intel Corporation · 12 open roles · median 147 d
- Monolithic Power Systems · 12 open roles · median 183 d
- onsemi · 7 open roles · median 63 d
How we counted: 199 open Packaging Engineering (Packaging) roles from 41 employers tracked in the SemiconductorJobs index, counted 19 Sept 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.