Staff Engineer-Lead frame & Package Design - Ipoh, Malaysia
Originally posted 30 September 2026 by the employer.
About the role
This role involves design generation and review for new semiconductor packages or platforms, including components, sub-assembly, and package outline for new platforms and devices.
What you'll do
- Perform design generation and reviews for new packages or platforms.
- Ensure appropriate documentation for new and existing design changes in PDM.
- Participate in Assembly & Test Design Rules, Design of Manufacturing (DFM), and feasibility studies.
- Maintain and revise Design rules considering suppliers, equipment, and customer requirements.
What you'll need
- University graduate in an Engineering course.
- Knowledge in mechanical design (2D & 3D) Software.
- 5 to 8 years of experience in semiconductor packaging & lead frame design.
- Experience with AutoCAD.
Skills: lead frame design, package design, mechanical design, semiconductor assembly, AutoCAD
This role has been open 0 days — well below the 74-day median for Packaging Engineering roles.
Packaging Engineering · Packaging
|
Open roles in category
202
|
Median days open
74 d
|
Median salary
$165k
|
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
| Metric | Wolfspeed | All employers we track in this specialty (202 roles · 42 employers) |
|---|---|---|
| Open roles in this specialty | 2 | 202 |
| Open roles in the wider Process, Fab & Equipment family | 76 | 9575 · 108 employers |
| Median days open | 0 d | 74 d (−74 d vs this employer) |
| Median salary (USD postings) | — | $165k |
Skills observed across this category: lead frame design, package design, mechanical design, semiconductor assembly, AutoCAD
Who's hiring in this category
- Infineon Technologies · 27 open roles · median 41 d
- Renesas Electronics · 23 open roles · median 33 d
- Micron Technology · 17 open roles · median 147 d
- Intel Corporation · 12 open roles · median 158 d
- Monolithic Power Systems · 12 open roles · median 194 d
- onsemi · 12 open roles · median 17 d
How we counted: 202 open Packaging Engineering (Packaging) roles from 42 employers tracked in the SemiconductorJobs index, counted 30 Sept 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.