Originally posted 24 September 2026 by the employer.
About the role
This role involves post-layout STA signoff and timing closure for high-speed interface IPs. The focus is on high-speed Memory Interface IPs such as DDR PHY, ONFI PHY, and IO Expander.
What you'll do
- Perform post-layout STA signoff and timing closure of high-speed interface IPs.
- Collaborate with IP Design, SoC Synthesis, and SoC Physical Design teams throughout IP development and SoC integration.
- Conduct MMMC timing analysis and closure across functional, scan, MBIST, and other DFT modes.
- Develop, validate, and debug timing constraints, including clocks, generated clocks, timing exceptions, and mode-specific constraints.
- Generate and validate Liberty (.lib) and ETM timing models, ensuring high-quality timing collateral.
- Support verification teams with SDF generation, validation, and Gate-Level Simulation (GLS).
What you'll need
- 6-10 years of experience in Static Timing Analysis (STA) with 4+ successful tapeouts.
- Expertise with Cadence Tempus.
- In-depth experience in MMMC timing analysis and closure.
- Experience working on high-speed Memory Interface IPs such such as DDR PHY, ONFI PHY, IO Expander (IOE), or similar high-performance interface designs.
- Strong understanding of timing constraints development, validation, and debug.
- Experience in Liberty (.lib) and ETM timing model generation, validation, correlation, and quality assessment.
- Hands-on experience with SDF generation, validation, and Gate-Level Simulation (GLS) support.
- Solid understanding of setup/hold analysis, recovery/removal checks, pulse-width verification, OCV/AOCV/POCV methodologies, and SI-aware timing signoff.
- Experience with Cadence digital implementation and signoff flow, including Genus, Innovus, and Tempus.
- Proficiency in TCL and/or Python for timing analysis, methodology development, and flow automation.
Nice to have
- Experience with advanced-node, high-frequency designs including LPDDR/DDR, ONFI, IO Expander, or similar memory and interface IPs.
- Exposure to AMS/Digital-on-Top IP development flows and timing signoff challenges associated with mixed-signal integrations.
- Familiarity with AI-powered EDA solutions, Agentic AI workflows for design automation and productivity enhancement.
Skills: post-layout STA signoff, timing closure, high-speed interface IPs, Cadence Tempus, MMMC timing analysis
More semiconductor jobs: Micron Technology jobs · Physical design jobs · India jobs
This role has been open 42 days — well below the 63-day median for Physical Design roles.
Physical Design · Physical Design
|
Open roles in category
708
|
Median days open
63 d
|
Category median salary (all employers)
$185k
|
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
| Metric | Micron Technology | All employers we track in this specialty (708 roles · 87 employers) |
|---|---|---|
| Open roles in this specialty | 17 | 708 |
| Open roles in the wider Physical Implementation family | 74 | 1591 · 117 employers |
| Median days open | 82 d | 63 d (+19 d vs this employer) |
| Median salary (USD postings) | — | $185k |
Skills observed across this category: post-layout STA signoff, timing closure, high-speed interface IPs, Cadence Tempus, MMMC timing analysis
Who's hiring in this category
- Qualcomm · 109 open roles · median 57 d
- AMD · 61 open roles · median 37 d
- Broadcom · 49 open roles · median 37 d
- NVIDIA · 45 open roles · median 78 d
- Synopsys · 43 open roles · median 36 d
- Intel Corporation · 33 open roles · median 27 d
How we counted: 708 open Physical Design (Physical Design) roles from 87 employers tracked in the SemiconductorJobs index, counted 5 Nov 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Physical Implementation family row. Figures refresh nightly.